H10W 70/451
Multilayered leadframes
Official title: {Multilayered leadframes}
H10W70/451 (Multilayered leadframes) appears on 229 US grants and 214 published applications in this corpus.
Search patents in H10W- Granted patents
- 229
- Published applications
- 214
- Assignees
- 112
- Inventors
- 514
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 9 | 0 |
| 1995 | 8 | 0 |
| 1996 | 5 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 6 | 0 |
| 2000 | 4 | 0 |
| 2001 | 0 | 0 |
| 2002 | 3 | 0 |
| 2003 | 0 | 0 |
| 2004 | 1 | 1 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 3 |
| 2008 | 1 | 3 |
| 2009 | 0 | 4 |
| 2010 | 3 | 4 |
| 2011 | 2 | 2 |
| 2012 | 3 | 4 |
| 2013 | 2 | 7 |
| 2014 | 8 | 5 |
| 2015 | 9 | 14 |
| 2016 | 9 | 8 |
| 2017 | 13 | 22 |
| 2018 | 16 | 15 |
| 2019 | 17 | 13 |
| 2020 | 16 | 22 |
| 2021 | 9 | 15 |
| 2022 | 15 | 16 |
| 2023 | 16 | 17 |
| 2024 | 11 | 14 |
| 2025 | 7 | 15 |
| 2026 | 7 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Lead frame15 Sep 2026US 12,740,437 B2Chang Wah Technology Co., Ltd.
- Semiconductor devices including a premolded leadframe and a semiconductor package1 Sep 2026US 12,727,489 B2Infineon Technologies AG
- Power module having a multi-level lead frame11 Aug 2026US 12,708,059 B2Infineon Technologies AG
- Metal component including phosphorous-containing nickel layer4 Aug 2026US 12,702,020 B2Mitsui High-Tec, Inc.
- Optical coupling device31 Mar 2026US 12,593,722 B2Kabushiki Kaisha Toshiba
- Semiconductor devices and methods of manufacturing semiconductor devices27 Aug 2026US 2026/0255987 A1Amkor Technology Singapore Holding Pte.Ltd.
- Ultra-low inductance fast switching packaging design for wide bandgap power modules18 Jun 2026US 2026/0173899 A1Alliance for Energy Innovation, LLC
- Hybrid-material leads for solderless coupling of an electronic component28 May 2026US 2026/0150713 A1Semiconductor Components Industries, LLC
- Nanotwin copper plating for multi-layered leadframes19 Mar 2026US 2026/0082940 A1
- Molded packages with attached connectors12 Mar 2026US 2026/0076219 A1NXP USA, Inc.
Most cited
By later US patents
- Combination of semiconductor interconnect212US 5,917,242 AMicron Technology, Inc. · 1999
- Metal plane support for multi-layer lead frames and a process for manufacturing such frames190US 5,410,180 AIntel Corporation · 1995
- Lead frame and method for manufacturing same159US 5,643,433 AShinko Electric Industries Co., Ltd. · 1997
- High performance versatile thermally enhanced IC chip mounting144US 5,138,430 AInternational Business Machines Corporation · 1992
- Multi-layer molded plastic IC package141US 4,891,687 AIntel Corporation · 1990