Combination of semiconductor interconnect

A semiconductor die assembly comprising:

• a first semiconductor die having at least one direct-to-substrate conductor type electrical connector and at least one bond pad;
• a second semiconductor die having at least one bond pad;
• said first and said second semiconductor dice paired and adhered together back-to-back;
• at least one substrate including a plurality of conductors wherein said at least one electrical connector of said first semiconductor is directly connected to and in electrical communication with one of said plurality of conductors and said at least one bond pad of said first semiconductor is connected to and in electrical communication with a second one of said plurality of conductors through an intermediate conductive element, and wherein said at least one bond pad of said second semiconductor is electrically connected to and in electrical communication with a third one of said plurality of said plurality of conductors.

A semiconductor die assembly comprising:

• a first semiconductor die having at least one direct-to-substrate conductor type electrical connector;
• a second semiconductor die having at least one bond pad;
• said first and said second semiconductor dice paired and adhered together back-to-back;
• at least one leadframe including a plurality of lead fingers wherein said at least one electrical connector of said first semiconductor die is directly connected to and in electrical communication with one of said plurality of lead fingers and said at least one bond pad of said second semiconductor die is connected to and in electrical communication with a second one of said plurality of conductors through an intermediate conductive element.