Nanotwin copper plating for multi-layered leadframes

An apparatus, comprising:

• a multi-layer leadframe comprising:
• a first layer comprising:
• spaced apart regions of electrically conductive material, defining respective vias, distributed across and extending from a first surface of the first layer of the leadframe into at least the first layer of the leadframe;
• and
• a first volume of an insulating material surrounding each of the respective terminals in the at least first layer of the leadframe;
• a second layer over the first surface of the first layer, the second layer comprising:
• a nanotwin copper bond pad coupled to a respective one of the terminals and extending outwardly from the first surface of the first layer to terminate in a second surface of the leadframe;
• and
• a second volume of the insulating material surrounding the nanotwin copper bond pad in the second layer of the leadframe.

A packaged integrated circuit device, comprising:

• a multi-layer substrate that comprises:
• a first layer comprising a die pad and a plurality of nanotwin copper bond pads arranged and distributed about the die pad in the first layer of the multi-layer substrate, in which each of the nanotwin copper bond pads has sidewalls surrounded by an electrically insulating material in the first layer of the multilayer substrate;
• and
• a second layer comprising a plurality of spaced apart regions of electrically conductive material, defining respective terminals, are distributed across the second layer of the multi-layer substrate, in which each of the respective terminals is coupled to a respective nanotwin copper bond pad, and each of the respective terminals extends into and is surrounded by an insulating material in the second layer of the multi-layer substrate;
• a die on a surface of the die pad, in which the die includes a plurality of die bond pads on the surface thereof that is spaced apart from the surface of the die pad;
• bond wires coupled between each of the die bond pads and respective nanotwin copper bond pads;
• and
• mold compound over the die, the bond wires and at least a portion of the multi-layer substrate.