Molded packages with attached connectors

A method of providing an electronic device, the method comprising:

• providing a molded package having:
• a semiconductor die,
• a set of metallic pads that electrically couples with the semiconductor die, and
• perimeter terminals disposed around the set of metallic pads;
• placing a set of connectors in contact with the set of metallic pads;
• and
• while the set of connectors is in contact with the set of metallic pads and protrudes from the molded package, attaching the set of connectors to the set of metallic pads.

An electronic device, comprising:

• a molded package including:
• a semiconductor die,
• a set of metallic pads that electrically couples with the semiconductor die,
• perimeter terminals disposed around the set of metallic pads, and
• a molded body portion which encapsulates the semiconductor die and defines a bottom surface which exposes the set of metallic pads;
• and
• a set of connectors attached to the set of metallic pads of the molded package and extending beyond the bottom surface defined by the molded body portion of molded package to provide electrical access to the semiconductor die through the set of metallic pads;
• wherein the set of metallic pads of the molded package includes a first metallic pad and a second metallic pad;
• wherein the set of connectors includes:
• a first dual gauge connector having a pad end which attaches directly to the first metallic pad and a free end, and
• a second dual gauge connector having a pad end which attaches directly to the second metallic pad and a free end;
• wherein the free ends of the first and second dual gauge connectors are thicker than the pad ends of the first and second dual gauge connectors;
• wherein the pad ends of the first and second dual gauge connectors are separated by a first distance;
• and
• wherein the free ends of the first and second dual gauge connectors are separated by a second distance that is greater than the first distance.