Semiconductor devices including a premolded leadframe and a semiconductor package

A semiconductor device, comprising:

• a premolded leadframe, comprising a main surface, at least one electrical contact extending out of the main surface, and an opposite main surface arranged opposite to the main surface;
• and
• a semiconductor package arranged on the main surface and laterally displaced to the at least one electrical contact of the premolded leadframe, wherein the semiconductor package comprises a semiconductor chip and at least one electrical contact,
• wherein surfaces of the at least one electrical contact of the premolded leadframe and the at least one electrical contact of the semiconductor package facing away from the main surface are flush,
• wherein the premolded leadframe comprises:
• an electrically conductive plate that is formed from a metal or a metal alloy;
• and regions of electrically insulating mold material,
• wherein the regions of electrically insulating mold material are arranged within openings that extend completely through a thinner part of the electrically conductive plate.