Hybrid-material leads for solderless coupling of an electronic component

A method comprising:

• preparing an internal substrate;
• coupling a semiconductor die with the internal substrate;
• mounting the internal substrate on a metal portion of a device package, the metal portion including a plurality of leads each constructed of a first conductive material and a second conductive material, the first conductive material being configured to maintain a rigid structure within an ultrasonic field produced by an ultrasonic welding tool and the second conductive material being configured to plastically deform within the ultrasonic field to bond to an external substrate;
• establishing electrical connections from the plurality of leads to the internal substrate and the semiconductor die;
• and
• encasing the internal substrate, the semiconductor die, the electrical connections, and a portion of each of the plurality of leads in a molding material of the device package.

A power inverter module comprising:

• a substrate;
• a heatsink;
• and
• a plurality of chips each physically coupled with the heatsink and electrically coupled with the substrate, the plurality of chips including a chip having a plurality of semiconductor dies contained within a device package from which a plurality of leads extends, the plurality of leads including a lead constructed of a first conductive material and a second conductive material, wherein:
• the first conductive material is configured to maintain a rigid structure within an acoustic field, and
• the second conductive material is configured to plastically deform within the acoustic field to bond to the substrate while the acoustic field is produced and the lead is in physical contact with the substrate.