H10W 70/475
Capacitors in combination with leadframes
Official title: {Capacitors in combination with leadframes}
H10W70/475 (Capacitors in combination with leadframes) appears on 432 US grants and 465 published applications in this corpus.
Search patents in H10W- Granted patents
- 432
- Published applications
- 465
- Assignees
- 184
- Inventors
- 886
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 5 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 6 | 0 |
| 1992 | 4 | 0 |
| 1993 | 7 | 0 |
| 1994 | 4 | 0 |
| 1995 | 4 | 0 |
| 1996 | 6 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 6 | 0 |
| 2001 | 7 | 1 |
| 2002 | 4 | 8 |
| 2003 | 8 | 11 |
| 2004 | 11 | 5 |
| 2005 | 1 | 8 |
| 2006 | 4 | 4 |
| 2007 | 6 | 7 |
| 2008 | 2 | 10 |
| 2009 | 5 | 14 |
| 2010 | 7 | 16 |
| 2011 | 15 | 9 |
| 2012 | 14 | 17 |
| 2013 | 11 | 13 |
| 2014 | 14 | 27 |
| 2015 | 27 | 24 |
| 2016 | 17 | 21 |
| 2017 | 30 | 31 |
| 2018 | 21 | 28 |
| 2019 | 23 | 25 |
| 2020 | 33 | 31 |
| 2021 | 23 | 33 |
| 2022 | 23 | 22 |
| 2023 | 22 | 21 |
| 2024 | 16 | 30 |
| 2025 | 19 | 33 |
| 2026 | 10 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device and semiconductor module15 Sep 2026US 12,740,440 B2LAPIS Technology Co., Ltd.
- Semiconductor device11 Aug 2026US 12,708,058 B2Rohm Co., Ltd.
- Substrate-on-die package architecture4 Aug 2026US 12,702,021 B2Texas Instruments Incorporated
- Semiconductor device28 Jul 2026US 12,696,767 B2Sumitomo Electric Device Innovations, Inc.
- Power conversion device and manufacturing method therefor28 Jul 2026US 12,696,822 B2Mitsubishi Electric Corporation
- Interdigital capacitor1 Oct 2026US 2026/0305385 A1
- Semiconductor device24 Sep 2026US 2026/0293272 A1Kabushiki Kaisha Toshiba
- Semiconductor device6 Aug 2026US 2026/0231839 A1Renesas Electronics Corporation
- Ic including capacitor having segmented bottom plate30 Jul 2026US 2026/0223380 A1Texas Instruments Incorporated
- Semiconductor device30 Jul 2026US 2026/0223755 A1Rohm Co., Ltd.
Most cited
By later US patents
- Method for producing high speed integrated circuits354US 5,214,845 AMicron Technology, Inc. · 1993
- Integrated capacitor on the back of a chip205US 6,373,127 B1Texas Instruments Incorporated · 2002
- Semiconductor device and a method for fabricating the same154US 4,984,059 AFujitsu Limited · 1991
- Low impedance package for integrated circuit die130US 4,680,613 AFairchild Semiconductor Corporation · 1987
- Internally decoupled integrated circuit package112US 5,095,402 ARogers Corporation · 1992