Semiconductor device

A semiconductor device comprising:

• a semiconductor chip including:
• a substrate;
• a transistor provided on an upper surface of the substrate and having an input electrode to which a high frequency signal is input, an output electrode from which the high frequency signal is output, and a reference potential electrode to which a reference potential is supplied;
• and
• a metal pattern provided on the upper surface of the substrate and electrically connected to the reference potential electrode;
• a first capacitor including:
• a first lower electrode provided on the metal pattern and electrically connected to the metal pattern,
• a first dielectric layer provided on the first lower electrode, and
• a first upper electrode provided on the first dielectric layer;
• a first bonding wire electrically connecting the first upper electrode and a first electrode which is any one of the input electrode and the output electrode;
• a conductive base on which the semiconductor chip is mounted and to which the reference potential is supplied;
• a second capacitor provided on a region of the base other than another region where the semiconductor chip is mounted and including a second lower electrode electrically connected to the conductive base, a second dielectric layer provided on the second lower electrode, and a second upper electrode provided on the second dielectric layer;
• and
• a second bonding wire electrically connecting the second upper electrode and a second electrode other than the first electrode of the input electrode and the output electrode.