Semiconductor device and a method for fabricating the same
AssigneeFujitsu Limited
InventorsAkihiro Kubota, Rikio Sugiura, Tsuyoshi Aoki, Michio Ono
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Abstract
In a plastic molded semiconductor device in which inner leads overlap a semiconductor chip in a molded plastic body, the width of the chip may be close to the width of the plastic body without a decrease in the high resistance of the inner leads to the pull out thereof from the plastic body, and the layout of the inner leads may be unrestricted since the inner leads may occupy the region above the chip.
Claims10
A semiconductor device having a molded plastic body, said semiconductor device comprising:
- a semiconductor chip having a major surface and having electrodes formed on said major surface, said semiconductor chip being encapsulated in the molded plastic body;
- a thin, flat, self-supportive metal stage onto which said semiconductor chip is bonded so that said major surface is opposite to and faces said metal stage, said stage being encapsulated in said molded plastic body;
- a plurality of leads, each comprising an inner lead end portion embedded in the molded plastic body and an outer lead end portion extending outside of the molded plastic body, said inner lead end portions of the leads being spaced apart from said semiconductor chips, said inner lead end portion of at least one of the leads overlapping said stage and extending over said major surface of said semiconductor chip;
- and
- interconnection wires interconnecting each of said inner lead end portions and each of said electrodes of said semiconductor chip.
A semiconductor device having a molded plastic body, said semiconductor device comprising:
- a semiconductor chip having electrodes and being encapsulated in the molded plastic body;
- a thin, flat, self-supportive metal stage onto which said semiconductor chip is bonded, said stage being encapsulated in said molded plastic body;
- a plurality of leads, each comprising an inner lead end portion embedded in the molded plastic body and an outer lead end portion extending outside of the molded plastic body, said inner lead end portions of the leads being spaced apart from said semiconductor chips, said inner lead end portion of at least one of the leads overlapping said stage and said semiconductor chip;
- and
- interconnection wires interconnecting each of said inner lead end portions and each of said electrodes of said semiconductor chip, wherein said electrodes are arranged along at least one side of said semiconductor chip and said inner lead end portion of at least one of said leads extends over said semiconductor chip to a position adjacent to inner sides of said electrodes relative to said semiconductor chip.
A semiconductor device having a molded plastic body, said semiconductor device comprising:
- a semiconductor chip having electrodes and being encapsulated in the molded plastic body;
- a thin, flat, self-supportive metal stage onto which said semiconductor chip is bonded, said stage being encapsulated in said molded plastic body;
- a plurality of leads, each comprising an inner lead end portion embedded in the molded plastic body and an outer lead end portion extending outside of the molded plastic body, said inner lead end portions of the leads being spaced apart from said semiconductor chips, said inner lead end portion of at least one of the leads overlapping said stage and said semiconductor chip;
- and
- interconnection wires interconnecting each of said inner lead end portions and each of said electrodes of said semiconductor chip, wherein the stage is a capacitor made of a ceramic plate having two electrodes, each electrode being interconnected to one of the leads.
Dependencies are inferred from the claim text.