Semiconductor device

A semiconductor device comprising:

• a first die pad;
• a second die pad spaced apart from the first die pad in a first direction and having a potential different from a potential of the first die pad;
• a semiconductor element mounted on the first die pad and constituting a first circuit together with the first die pad;
• a semiconductor element mounted on the second die pad and constituting a second circuit together with the second die pad;
• an insulating element mounted on one of the first die pad and the second die pad, relaying transmission and reception of a signal between the first circuit and the second circuit, and insulating the first circuit and the second circuit from each other,
• a first wire bonded to the insulating element and the semiconductor element mounted on the other of the first die pad and the second die pad;
• and
• a sealing resin covering the first die pad, the second die pad, the semiconductor element mounted on the one of the first die pad and the second die pad, the semiconductor element mounted on the other of the first die pad and the second die pad, and the insulating element, the sealing resin insulating the first die pad and the second die pad from each other,
• wherein the first wire bridges across a pad gap provided between the first die pad and the second die pad in the first direction,
• the first wire has a first upright section, a first inclined section, a first extended section, a first bent section, and a second bent section, the first upright section rising from the insulating element in a thickness direction of the one of the first die pad and the second die pad, the first inclined section being inclined relative to the thickness direction and extending from the semiconductor element mounted on the other of the first die pad and the second die pad toward the insulating element, the first extended section being located between the first upright section and the first inclined section as viewed in the thickness direction, the first bent section being connected to the first upright section and the first extended section, the second bent section being connected to the first inclined section and the first extended section,
• an inclination angle of the first extended section relative to a plane perpendicular to the thickness direction is smaller than an inclination angle of the first inclined section relative to the plane,
• a length of the first extended section is greater than a length of each of the first upright section, the first inclined section, the first bent section, and the second bent section,
• each of the first bent section and the second bent section includes a curved portion,
• in an entirety of the first wire, a boundary between the first extended section and the first bent section is located farthest from the one of the first die pad and the second die pad in the thickness direction, and
• an inclination angle of the first upright section relative to the plane is greater than each of the inclination angle of the first extended section and the inclination angle of the first inclined section.