Interdigital capacitor
OwnerYiqi TANG, Rajen Manicon MURUGANinventors
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Abstract
A routable lead frame (RLF) substrate has a conductive layer having first- and second-side traces having first fingers and second fingers, respectively, which are interdigitated with each other. A via layer is over the conductive layer. A first-side conductive via of the via layer is conductively coupled to the first-side trace. A second-side conductive via of the via layer is conductively coupled to the second-side trace. Dielectric molding material is disposed between the interdigitated fingers of the conductive layer and between the first-side conductive via and the second-side conductive via. The fingers and vias form an interdigital capacitor (IDC) useful in impedance matching and filtering.
Claims15
A method of manufacturing a substrate, comprising:
- providing a carrier;
- forming a conductive layer on the carrier, the conductive layer having a first trace comprising first fingers and a second trace comprising second fingers, the first fingers interdigitated with the second fingers;
- forming a via layer over the conductive layer, the via layer comprising a first via conductively coupled to the first trace and a second via conductively coupled to the second trace;
- forming a dielectric layer, the dielectric layer disposed between the first trace and the second trace and between the first via and the second via;
- and
- removing the carrier, wherein the first via comprises a comb shape.
A method of forming an integrated circuit (IC), comprising:
- providing a substrate;
- attaching an IC die to the substrate, the IC die conductively coupled to a surface of the substrate;
- and
- covering the IC die and the surface of the substrate using mold compound, wherein the substrate comprises:
- a first conductive layer having a first trace comprising first fingers and a second trace comprising second fingers, the first fingers interdigitated with the second fingers;
- a first via layer comprising a first via conductively coupled to the first trace and a second via conductively coupled to the second trace;
- and
- dielectric material disposed between the first trace and the second trace and between the first via and the second via, wherein the first via comprises a comb shape.
Dependencies are inferred from the claim text.