Semiconductor device and semiconductor module
AssigneeLAPIS Technology Co., Ltd.
InventorKoya Shimazaki
Life of this patent
Estimating the term…
Loading patent…
AssigneeLAPIS Technology Co., Ltd.
InventorKoya Shimazaki
Estimating the term…
A semiconductor device includes a semiconductor IC, a capacitor element, a support portion, a first conductor and second conductor, and a sealing body. The semiconductor IC has a first IC terminal and a second IC terminal. The capacitor element has a first terminal and a second terminal. The support portion supports the capacitor element and the semiconductor IC. The first conductor and second conductor extend so as to connect the first terminal and second terminal with, respectively, the first IC terminal and second IC terminal. The sealing body encloses the capacitor element, the semiconductor IC, the first conductor, the second conductor and the support portion. The first IC terminal and second IC terminal, the first terminal and second terminal, the first conductor and the second conductor are disposed at the inner side relative to an outer edge of the support portion.
A semiconductor device comprising:
Dependencies are inferred from the claim text.