Electronic device with high draft angle package structure

An electronic device, comprising:

• a package structure having a first side, a second side, a third side, a fourth side, a fifth side, and a sixth side, the first and second sides spaced apart from one another along a first direction, the third and fourth sides spaced apart from one another along a second direction that is orthogonal to the first direction, the fifth and sixth sides spaced apart from one another along a third direction that is orthogonal to the first and second directions;
• and
• a conductive lead partially exposed outside the package structure;
• the first side having a first portion and a second portion, the first portion of the first side extending at a first angle from a first plane of the second and third directions to the sixth side, the second portion of the first side extending from the first plane of the second and third directions to the fifth side, the first angle being greater than 15 degrees, and the first angle being 25 degrees or less;
• the second side having a first portion and a second portion, the first portion of the second side extending at the first angle from a second plane of the second and third directions to the sixth side, and the second portion of the second side extending from the second plane of the second and third directions to the fifth side;
• the third side having a first portion and a second portion, the first portion of the third side extending at the first angle from a first plane of the first and third directions to the sixth side, and the second portion of the third side extending from the first plane of the first and third directions to the fifth side;
• and
• the fourth side having a first portion and a second portion, the first portion of the fourth side extending at the first angle from a second plane of the first and third directions to the sixth side, and the second portion of the fourth side extending from the second plane of the first and third directions to the fifth side.