H10W 70/481
For devices being provided for in groups h10d8/00 - h10d48/00
Official title: {for devices being provided for in groups H10D8/00 - H10D48/00}
H10W70/481 (For devices being provided for in groups h10d8/00 - h10d48/00) appears on 3,452 US grants and 4,353 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,452
- Published applications
- 4,353
- Assignees
- 559
- Inventors
- 4,839
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 5 | 0 |
| 1978 | 9 | 0 |
| 1979 | 4 | 0 |
| 1980 | 5 | 0 |
| 1981 | 4 | 0 |
| 1982 | 4 | 0 |
| 1983 | 3 | 0 |
| 1984 | 6 | 0 |
| 1985 | 8 | 0 |
| 1986 | 9 | 0 |
| 1987 | 9 | 0 |
| 1988 | 4 | 0 |
| 1989 | 7 | 0 |
| 1990 | 7 | 0 |
| 1991 | 15 | 0 |
| 1992 | 11 | 0 |
| 1993 | 7 | 0 |
| 1994 | 8 | 0 |
| 1995 | 10 | 0 |
| 1996 | 19 | 0 |
| 1997 | 8 | 0 |
| 1998 | 13 | 0 |
| 1999 | 17 | 0 |
| 2000 | 16 | 0 |
| 2001 | 26 | 13 |
| 2002 | 31 | 44 |
| 2003 | 31 | 47 |
| 2004 | 46 | 62 |
| 2005 | 43 | 66 |
| 2006 | 48 | 72 |
| 2007 | 39 | 95 |
| 2008 | 50 | 102 |
| 2009 | 55 | 101 |
| 2010 | 104 | 74 |
| 2011 | 67 | 96 |
| 2012 | 94 | 135 |
| 2013 | 100 | 149 |
| 2014 | 135 | 200 |
| 2015 | 194 | 234 |
| 2016 | 207 | 225 |
| 2017 | 220 | 200 |
| 2018 | 177 | 195 |
| 2019 | 189 | 223 |
| 2020 | 166 | 227 |
| 2021 | 204 | 271 |
| 2022 | 192 | 284 |
| 2023 | 182 | 355 |
| 2024 | 212 | 415 |
| 2025 | 248 | 296 |
| 2026 | 180 | 172 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Half-bridge circuit using monolithic flip-chip GAN power devices6 Oct 2026US 12,756,203 B2Navitas Semiconductor Limited
- Semiconductor package having lead frame with slanted sections6 Oct 2026US 12,757,755 B2Alpha and Omega Semiconductor International LP
- Package with low-warpage carrier6 Oct 2026US 12,757,756 B2Infineon Technologies AG
- Power semiconductor package6 Oct 2026US 12,757,757 B2Pierburg GmbH
- Semiconductor device and method of manufacturing the same6 Oct 2026US 12,757,778 B2Mitsubishi Electric Corporation
- Semiconductor device and method of manufacturing semiconductor device8 Oct 2026US 2026/0314437 A1Mitsubishi Electric Corporation
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
- Semiconductor device8 Oct 2026US 2026/0314463 A1Kabushiki Kaisha Toshiba
- Semiconductor device1 Oct 2026US 2026/0305334 A1Fuji Electric Co., Ltd.
- Dual die device with conductive plate substrate connection1 Oct 2026US 2026/0305384 A1
Most cited
By later US patents
- Indicators and illuminators using a semiconductor radiation emitter package518US 6,441,943 B1Gentex Corporation · 2002
- Semiconductor radiation emitter package423US 6,335,548 B12002
- Electrochromic rearview mirror assembly incorporating a display/signal light382US 6,700,692 B2Gentex Corporation · 2004
- Surface-mount flat package semiconductor device285US 5,521,429 ASanyo Electric Co., Ltd. · 1996
- Plural semiconductor die housed in common package with split heat sink266US 5,977,630 AInternational Rectifier Corporation · 1999