Dual die device with conductive plate substrate connection
OwnerWoochan Kim, Makoto Shibuya +3inventors
InventorsWoochan Kim, Makoto Shibuya, Nathan Schemm, Sahana Sriraj, Abha Kasper
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Abstract
An electronic device includes a first semiconductor die having a first side, an opposite second side, and a first terminal along the first side, the second side of the first semiconductor die electrically connected to a conductive plate, a second semiconductor die having a first side, an opposite second side, and a second terminal along the first side, the second side of the second semiconductor die electrically connected to the conductive plate, and a bond wire that electrically connects the first and second terminals.
Claims20
An electronic device, comprising:
- a first semiconductor die having a first side, an opposite second side, and a first terminal along the first side, the second side of the first semiconductor die electrically connected to a conductive plate;
- a second semiconductor die having a first side, an opposite second side, and a second terminal along the first side, the second side of the second semiconductor die electrically connected to the conductive plate;
- and
- a bond wire that electrically connects the first and second terminals.
An electronic device, comprising:
- a first semiconductor die having a gallium nitride substrate with a first side and an opposite second side attached to a conductive plate by a first conductive adhesive;
- a second semiconductor die having a silicon substrate with a first side and an opposite second side attached to the conductive plate by a second conductive adhesive;
- and
- an electrical connection between a first conductive feature on the first side of the first semiconductor die and a second conductive feature on the first side of the second semiconductor die.
A method of fabricating an electronic device, the method comprising:
- attaching a first side of a first semiconductor die to a lead frame;
- attaching a conductive plate to a second side of the first semiconductor die;
- attaching a second side of a second semiconductor die to the conductive plate;
- and
- forming an electrical connection between a first terminal along the first side of the first semiconductor die and a second terminal along a first side of the second semiconductor die.
A system, comprising:
- a circuit board;
- and
- an electronic device mounted to the circuit board and comprising:
- a first semiconductor die having a first side, an opposite second side, and a first terminal along the first side, the second side of the first semiconductor die electrically connected to a conductive plate;
- a second semiconductor die having a first side, an opposite second side, and a second terminal along the first side, the second side of the second semiconductor die electrically connected to the conductive plate;
- and
- a bond wire that electrically connects the first and second terminals.
Dependencies are inferred from the claim text.