Semiconductor device and method of manufacturing the same

A method of manufacturing a semiconductor device in which an electrical circuit including a semiconductor chip and a plurality of metal wires electrically connected to the semiconductor chip is sealed with a sealing material, comprising steps of:

• filling a cavity and at least a part of a sealing material storage part with the sealing material by injecting the sealing material from a first gate of a mold, the mold including the cavity in which the electrical circuit is disposed, the first gate and a second gate provided to the cavity, and the sealing material storage part provided to an outer side of the cavity to be connected to the second gate;
• making the sealing material filling the sealing material storage part flow back to the cavity via the second gate;
• hardening the sealing material after the sealing material flows back to the cavity via the second gate;
• and
• removing the sealing material which has been hardened and extends from the first gate or the second gate toward the outer side of the cavity, wherein
• the step of making the sealing material flow back into the cavity from the second gate includes a step of applying higher pressure to a second plunger for injecting the sealing material to the cavity from the second gate than pressure applied to a first plunger for injecting the sealing material to the cavity from the first gate such that the step of making the sealing material flow back into the cavity via the second gate causes a step of forming two or more curved parts in an elongate shape in a plan view of at least one metal wire in the plurality of metal wires, and
• the sealing material is resin.