Plural semiconductor die housed in common package with split heat sink
AssigneeInternational Rectifier Corporation
InventorsArthur Woodworth, George Pearson, Peter Richard Ewer
Life of this patent
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Abstract
A plurality of semiconductor die, which may be of diverse size and diverse junction pattern, are fixed to a common lead frame and within a common package. The semiconductor die are mounted on respective main pad areas that are laterally spaced from one another and which have respective heat sinks. The heat sinks extend from the boundary of the device package and form external pins that are available for external connection at the same or at different potentials. Isolated pins are also provided. The device package may be used for high and low side chopper circuits, synchronous regulator circuits, single-mode bridges, and the like.
Claims18
A conductive lead frame for supporting two or more semiconductor devices and encapsulated by a molded housing;
- said lead frame comprising:
- at least two laterally spaced main pad areas each having a respective heat sink and at least one external pin extending from an edge thereof, said heat sink extending from a bottom surface of said molded housing and said external pin extending beyond the boundary of said molded housing for external connection;
- and
- at least one isolated pin disposed along an edge of said molded housing and extending beyond the boundary of said molded housing for external connection;
- at least one of said main pad areas having an internal bonding region that is connectable with another of said main pad areas and that is connectable with said at least one isolated pin.
A semiconductor device package for housing two or more semiconductor devices;
- said device package comprising:
- a conductive lead frame that includes at least two main pad areas each having a respective heat sink and a respective external pin extending from an edge thereof, and at least one isolated pin separated from said at least two main pad areas and disposed opposite to said pins of said at least two main pad areas;
- and
- a molded housing for encapsulating said lead frame and said semiconductor devices;
- at least one of said at least two main pad areas having an internal bonding region that is connectable with another of said at least two main pad areas and that is connectable with said at least one isolated pin;
- said heat sinks extending beyond a bottom surface of said molded housing, and said pins of said at least two main pad areas and said isolated pins extending beyond the boundary of said molded housing for external connection.
A semiconductor device comprising:
- at least two semiconductor die each having opposing surfaces which each contain at least one respective electrode;
- a conductive lead frame that includes at least two main pad areas each having a heat sink and at least one external pin extending from an edge thereof, and at least one isolated pin separated from said at least two main pad areas and disposed opposite to said pins of said at least two main pad areas;
- at least one of said at least two main pad areas having an internal bonding region;
- one of said opposing surfaces of each of said at least two semiconductor die being disposed atop and in electrical contact with a respective one of said at least two main pad areas;
- another of said opposing surfaces of each of said at least two semiconductor die having at least one region that is wire bonded to one of said internal bonding regions and said isolated pin;
- and
- a molded housing for encapsulating said lead frame, said at least two semiconductor die and said bonding wires;
- said heat sinks and said pins of said at least two main pad areas and said isolated pins extending beyond the boundary of said molded housing for external connection.
Dependencies are inferred from the claim text.