H10W 70/453
Comprising flexible metallic tapes
Official title: {comprising flexible metallic tapes}
H10W70/453 (Comprising flexible metallic tapes) appears on 725 US grants and 393 published applications in this corpus.
Search patents in H10W- Granted patents
- 725
- Published applications
- 393
- Assignees
- 209
- Inventors
- 1,170
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 5 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 6 | 0 |
| 1981 | 6 | 0 |
| 1982 | 3 | 0 |
| 1983 | 4 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 5 | 0 |
| 1987 | 5 | 0 |
| 1988 | 5 | 0 |
| 1989 | 9 | 0 |
| 1990 | 15 | 0 |
| 1991 | 22 | 0 |
| 1992 | 27 | 0 |
| 1993 | 24 | 0 |
| 1994 | 33 | 0 |
| 1995 | 24 | 0 |
| 1996 | 17 | 0 |
| 1997 | 19 | 0 |
| 1998 | 41 | 0 |
| 1999 | 31 | 0 |
| 2000 | 42 | 0 |
| 2001 | 40 | 15 |
| 2002 | 39 | 49 |
| 2003 | 36 | 13 |
| 2004 | 15 | 19 |
| 2005 | 14 | 22 |
| 2006 | 9 | 20 |
| 2007 | 14 | 12 |
| 2008 | 16 | 20 |
| 2009 | 6 | 19 |
| 2010 | 16 | 19 |
| 2011 | 19 | 13 |
| 2012 | 17 | 10 |
| 2013 | 10 | 12 |
| 2014 | 11 | 15 |
| 2015 | 10 | 13 |
| 2016 | 10 | 13 |
| 2017 | 8 | 16 |
| 2018 | 14 | 5 |
| 2019 | 9 | 8 |
| 2020 | 7 | 19 |
| 2021 | 6 | 14 |
| 2022 | 10 | 7 |
| 2023 | 12 | 10 |
| 2024 | 8 | 11 |
| 2025 | 8 | 12 |
| 2026 | 4 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Sintered metal flip chip joints18 Aug 2026US 12,713,938 B2Texas Instruments Incorporated
- Semiconductor package film and manufacturing method thereof11 Aug 2026US 12,707,990 B2Samsung Display Co., Ltd.
- Electronic component, electric device including the same, and bonding method thereof27 Jan 2026US 12,538,424 B2Samsung Display Co., Ltd.
- Semiconductor device package with vertically stacked passive component20 Jan 2026US 12,532,786 B2Texas Instruments Incorporated
- High voltage flip-chip on lead (FOL) package18 Nov 2025US 12,476,170 B2Texas Instruments Incorporated
- Electronic device3 Sep 2026US 2026/0262509 A1Innolux Corporation
- Electronic component, electric device including the same, and bonding method thereof14 May 2026US 2026/0136465 A1Samsung Display Co., Ltd.
- Chip on film package and electronic device including the same7 May 2026US 2026/0130236 A1Samsung Electronics Co., Ltd.
- Film package, semiconductor module and display device including the same, and manufacturing method of film package7 May 2026US 2026/0130237 A1Samsung Electronics Co., Ltd.
- Chip mounted substrate and a display device26 Mar 2026US 2026/0090406 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Semiconductor integrated circuit device and method of manufacturing the same437US 4,982,265 AAkita Electronics Co., Ltd. · 1991
- Tab grid array357US 5,397,921 AAdvanced Semiconductor Assembly Technology · 1995
- Method for producing high speed integrated circuits354US 5,214,845 AMicron Technology, Inc. · 1993
- Lead connections means for stacked tab packaged IC chips312US 5,138,438 AAkita Electronics Co., Ltd. · 1992
- Semiconductor device having tab tape lead frame with reinforced outer leads280US 5,859,471 AShinko Electric Industries Co., Ltd. · 1999