Film package, semiconductor module and display device including the same, and manufacturing method of film package
AssigneeSamsung Electronics Co., Ltd.
InventorsSeunghyun Cho, JAE-MIN JUNG, Minwoo Cho, JEONG-KYU HA
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Abstract
A semiconductor module including a film package, and a printed circuit board connected to a first surface of the film package. The film package includes a base film, a semiconductor chip on the first surface of the base film, and a first conductive pattern on the first surface of the base film. The first conductive pattern includes a first circuit pattern and a first dummy pattern. The first dummy pattern is spaced apart from the first circuit pattern and is between the first surface of the base film and the printed circuit board.
Claims20
A semiconductor module, comprising:
- a film package;
- and
- a printed circuit board connected to a first surface of the film package,
- wherein the film package comprises:
- a base film;
- a semiconductor chip on the first surface of the base film;
- and
- a first conductive pattern on the first surface of the base film,
- wherein the first conductive pattern includes a first circuit pattern and a first dummy pattern, and
- wherein the first dummy pattern is spaced apart from the first circuit pattern and is between the first surface of the base film and the printed circuit board.
A display device, comprising:
- a film package;
- a printed circuit board connected to the film package;
- and
- a display panel connected to the film package,
- wherein the film package includes a base film, a semiconductor chip on a first surface of the base film facing the printed circuit board or the display panel, and a first conductive pattern on the first surface of the base film,
- wherein the first conductive pattern includes a first circuit pattern and a first dummy pattern, and
- wherein the first dummy pattern is spaced apart from the first circuit pattern and is between the first surface of the base film and the printed circuit board.
A film package, comprising:
- a base film;
- a semiconductor chip on a first surface of the base film;
- and
- a first conductive pattern on the first surface of the base film,
- wherein the first conductive pattern comprises:
- a first circuit pattern in a circuit region, wherein the first circuit pattern includes a first outer terminal at a first end of the circuit region in a first direction and a second outer terminal at a second opposite end of the circuit region in the first direction, and
- a first dummy pattern in a dummy region outside the circuit region in the first direction and electrically isolated from the first circuit pattern and the semiconductor chip.
Dependencies are inferred from the claim text.