H10W 70/411
Chip-supporting parts
Official title: {Chip-supporting parts, e.g. die pads}
H10W70/411 (Chip-supporting parts) appears on 4,891 US grants and 4,878 published applications in this corpus.
Search patents in H10W- Granted patents
- 4,891
- Published applications
- 4,878
- Assignees
- 703
- Inventors
- 6,392
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 12 | 0 |
| 1990 | 16 | 0 |
| 1991 | 21 | 0 |
| 1992 | 34 | 0 |
| 1993 | 45 | 0 |
| 1994 | 70 | 0 |
| 1995 | 59 | 0 |
| 1996 | 59 | 0 |
| 1997 | 60 | 0 |
| 1998 | 105 | 0 |
| 1999 | 116 | 0 |
| 2000 | 148 | 0 |
| 2001 | 174 | 81 |
| 2002 | 145 | 186 |
| 2003 | 159 | 141 |
| 2004 | 139 | 119 |
| 2005 | 116 | 130 |
| 2006 | 109 | 128 |
| 2007 | 81 | 135 |
| 2008 | 75 | 158 |
| 2009 | 87 | 136 |
| 2010 | 125 | 137 |
| 2011 | 131 | 122 |
| 2012 | 128 | 127 |
| 2013 | 118 | 141 |
| 2014 | 171 | 208 |
| 2015 | 203 | 238 |
| 2016 | 218 | 255 |
| 2017 | 269 | 262 |
| 2018 | 218 | 242 |
| 2019 | 209 | 243 |
| 2020 | 233 | 248 |
| 2021 | 186 | 259 |
| 2022 | 190 | 238 |
| 2023 | 187 | 270 |
| 2024 | 185 | 285 |
| 2025 | 156 | 227 |
| 2026 | 121 | 162 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Half-bridge circuit using monolithic flip-chip GAN power devices6 Oct 2026US 12,756,203 B2Navitas Semiconductor Limited
- Semiconductor package assembly with electric field modulation structures6 Oct 2026US 12,757,751 B2Nexperia B. V.
- Semiconductor module6 Oct 2026US 12,757,769 B2Shindengen Electric Manufacturing Co., Ltd.
- Electrical connector having contact elements with superelastic properties29 Sep 2026US 12,749,836 B2Amphenol Corporation
- Lead frame with a tie bar having branch part29 Sep 2026US 12,751,294 B2Diodes Incorporated
- Die attachment structure and method8 Oct 2026US 2026/0314435 A1NXP USA, Inc.
- Grounded leads in a quad-flat package8 Oct 2026US 2026/0314439 A1STMicroelectronics International N. V.
- Semiconductor device with an embedded passive component and method of making the same8 Oct 2026US 2026/0314485 A1Texas Instruments Incorporated
- Apparatus including an isolation assembly1 Oct 2026US 2026/0305369 A1
- Semiconductor device and method of manufacturing semiconductor device1 Oct 2026US 2026/0305383 A1Mitsubishi Electric Corporation
Most cited
By later US patents
- Package semiconductor chip567US 4,862,245 AInternational Business Machines Corporation · 1989
- Multi-chip semiconductor arrangements using flip chip dies446US 5,399,898 ALSI Logic Corporation · 1995
- Thin, stackable semiconductor packages437US 6,303,997 B1Amkor Technology, Inc. · 2001
- Encapsulated semiconductor device package having holes for electrically conductive material423US 5,608,265 AHitachi, Ltd. · 1997
- Semiconductor chip package377US 5,677,566 AMicron Technology, Inc. · 1997