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AssigneeHitachi, Ltd.
InventorsMakoto Kitano, Asao Nishimura, Akihiro Yaguchi, Nae Yoneda, Ryuji Kohno, Naotaka Tanaka, Tetsuo Kumazawa
Estimating the term…
A semiconductor device, provided in a plastic encapsulated package, having a semiconductor chip, a lead and a member for electrically connecting them together. The semiconductor device has one or more first holes respectively extending from one surface of the package to a first side of the lead which is provided inside of the package, and has one or more second holes formed which are aligned with the first holes, respectively, in a manner such that each second hole is extended from the opposing surface of the package to a corresponding location on a second side of the lead and is aligned with a corresponding, opposing first hole, in the package, extending to the first side of the lead. These holes are provided as a plurality of sets of individual pairs of aligned holes respectively extending inwardly, from opposing surfaces of the package, to opposite sides of the corresponding leads. In the device the leads or the leads with resin act as partitions thereby effecting isolation between the first and second holes of each pair aligned holes.
A semiconductor device, provided in a plastic encapsulated package, having a semiconductor chip, a plurality of leads and means for electrically connecting said chip and said leads to each other, said semiconductor device comprising:
A semiconductor device, provided in a plastic encapsulated package, including a semiconductor chip, a lead and means for electrically connecting said chip to said lead, wherein:
A semiconductor device, provided in a plastic encapsulated package, including a semiconductor chip, at least one lead and means for electrically connecting said chip to said lead, wherein:
A semiconductor device, provided in a plastic encapsulated package, including a semiconductor chip, a lead and means for electrically connecting said chip to said lead, wherein:
A lead frame comprising a plurality of leads, included in a plastic package of a semiconductor device, and an outer frame for supporting said leads, wherein:
A lead frame including a plurality of leads, included in a package of a plastic encapsulated semiconductor device, a chip pad for mounting a semiconductor chip of the device thereon, pad-suspending leads for supporting said chip pad and an outer frame for supporting said leads, said chip pad and said pad-suspending leads, wherein:
Dependencies are inferred from the claim text.