H10W 70/417
Bonding materials between chips and die pads
Official title: {Bonding materials between chips and die pads}
H10W70/417 (Bonding materials between chips and die pads) appears on 1,443 US grants and 1,776 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,443
- Published applications
- 1,776
- Assignees
- 334
- Inventors
- 2,610
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 5 | 0 |
| 1993 | 2 | 0 |
| 1994 | 8 | 0 |
| 1995 | 9 | 0 |
| 1996 | 5 | 0 |
| 1997 | 7 | 0 |
| 1998 | 14 | 0 |
| 1999 | 15 | 0 |
| 2000 | 22 | 0 |
| 2001 | 17 | 12 |
| 2002 | 19 | 17 |
| 2003 | 18 | 28 |
| 2004 | 26 | 13 |
| 2005 | 12 | 17 |
| 2006 | 14 | 16 |
| 2007 | 8 | 23 |
| 2008 | 11 | 34 |
| 2009 | 21 | 36 |
| 2010 | 24 | 33 |
| 2011 | 31 | 41 |
| 2012 | 28 | 37 |
| 2013 | 35 | 55 |
| 2014 | 58 | 102 |
| 2015 | 79 | 88 |
| 2016 | 86 | 109 |
| 2017 | 100 | 94 |
| 2018 | 84 | 108 |
| 2019 | 99 | 119 |
| 2020 | 90 | 112 |
| 2021 | 86 | 125 |
| 2022 | 83 | 97 |
| 2023 | 96 | 148 |
| 2024 | 73 | 131 |
| 2025 | 84 | 97 |
| 2026 | 69 | 84 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Lead-on-chip integrated circuit fabrication method296US 5,221,642 AStaktek Corporation · 1993
- Integrated circuit package having an interposer263US 5,332,864 AVLSI Technology, Inc. · 1994
- Package stack via bottom leaded plastic (BLP) packaging252US 5,986,209 AMicron Technology, Inc. · 1999
- Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer242US 5,286,679 AMicron Technology, Inc. · 1994
- Semiconductor device with plastic material covering a semiconductor chip mounted on a substrate of the device220US 5,818,105 ANEC Corporation · 1998