Semiconductor device with plastic material covering a semiconductor chip mounted on a substrate of the device

A plastic-covered semiconductor device comprising:

• a substrate having a first surface and a second surface opposite to said first surface;
• a semiconductor chip mounted on said first surface of said substrate, said chip being insulated from said substrate;
• lead fingers joined to said first surface of said substrate said lead fingers being insulated from said substrate;
• interconnecting conductors electrically interconnecting said semiconductor chip with said corresponding lead fingers, respectively;
• a plastic covering material formed to cover said first surface of said substrate;
• each of said lead fingers being made of an inner part bonded to said first surface of said substrate and an outer part protruding said covering material;
• said covering material confining said semiconductor chip, said interconnecting conductors and said inner parts of said lead fingers,
• an edge of said covering material being substantially in accordance with an edge of said first surface of said substrate;
• said second surface of said substrate being exposed from said covering material;
• said substrate acting as a top or bottom of a package of said semiconductor device;
• and
• a patterned conductive layer formed on said first surface of said substrate;
• wherein said interconnection conductors and said corresponding inner parts of said lead fingers are connected with each other through said patterned conductive layer, respectively.

A plastic-covered semiconductor device comprising:

• a substrate having a first surface and a second surface opposite to said first surface, said substrate being made of a synthetic resin;
• a semiconductor chip bonded onto said first surface of said substrate by a first insulating adhesive material which is a dispensable material;
• a patterned layer of a second insulating adhesive material formed on said first surface of said substrate and being of the type suitable for application by screen printing;
• lead fingers bonded onto said first surface of said substrate by said second insulating adhesive material;
• bonding wire pieces electrically interconnecting said semiconductor chip with said corresponding lead fingers, respectively;
• a plastic covering material formed to cover said first surface of said substrate and being of the type suitable for application by screen printing;
• each of said lead fingers being made of an inner part bonded onto said first surface of said substrate and an outer part protruding from said covering material;
• said covering material confining said semiconductor chip, said bonding wire pieces and said inner parts of said lead fingers;
• an edge of said covering material being substantially in accordance with an edge of said first surface of said substrate;
• said second surface of said substrate being exposed from said covering material;
• and
• said substrate acting as a top or bottom of a package of said semiconductor device.

A plastic-covered semiconductor device comprising:

• a substrate having a first surface and a second surface opposite to said first surface, said substrate being made of a ceramic;
• a patterned conductor layer formed on said first surface of said substrate;
• a semiconductor chip mounted on said first surface of said substrate;
• lead fingers joined to said patterned conductor layer;
• bonding wire pieces electrically interconnecting said semiconductor chip with said corresponding lead fingers, respectively;
• a plastic covering material formed to cover said first surface of said substrate;
• each of said lead fingers being made of an inner part bonded onto said patterned conductor layer and an outer part protruding from said covering material;
• said bonding wire pieces being bonded onto said patterned conductor layer;
• said covering material confining said semiconductor chip, said bonding wire pieces, said patterned conductor layer and said inner parts of said lead fingers;
• an edge of said covering material being substantially in accordance with an edge of said first surface of said substrate;
• said second surface of said substrate being exposed from said covering material;
• and
• said substrate acting as a top or bottom of a package of said semiconductor device.

In a plastic-covered semiconductor device comprising a substrate made of a material of a semiconductive material or an insulating material;

• a semiconductor chip mounted on a first surface of said substrate by a first insulating adhesive material which is a dispensable material;
• a patterned layer of a second insulating material formed on a second surface of the substrate and being of the type suitable for application by screen printing;
• lead fingers joined to said substrate;
• interconnecting conductors electrically interconnecting said semiconductor chip with said corresponding lead fingers, respectively;
• each of said lead fingers being made of an inner part and an outer part;
• a plastic covering material confining said semiconductor chip, said interconnecting conductors and said inner parts of said lead fingers;
• said inner parts of said lead fingers being bonded to said first surface of said substrate;
• and said outer parts of said lead fingers protruding from said covering material;
• said plastic covering material being formed only at one surface of said substrate, and an opposite surface of said substrate being exposed from said covering material;
• an edge of said covering material being substantially in accordance with an edge of said substrate, so that side faces of said covering material do not laterally protrude from said edge of said substrate;
• and
• said substrate acting as a top or bottom of a package of said semiconductor device.