Package stack via bottom leaded plastic (BLP) packaging
AssigneeMicron Technology, Inc.
InventorPatrick W. Tandy
Life of this patent
Estimating the term…
Abstract
A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminated. Lead connections are on the bottom package surface, over the top package surface, and/or on the sides and ends of the package, enabling vertical stacking of the devices and simultaneous/alternative coplanar horizontal connections to other semiconductor devices, circuit boards, etc. A mold assembly with a castellated inner surface forms a package with alternating grooves and columns for holding side and end electrical connection surfaces.
Claims14
A bottom-leaded packaged semiconductor device assembly, comprising:
- a semiconductor die;
- a leadframe including at least one lead having an upper surface, a lower surface, a plurality of edge surfaces, and a thickness, said at least one lead comprising:
- an inner end conductively connected to said semiconductor die;
- an intermediate portion configured for connection to a first electrical apparatus;
- and
- an outer lead configured for connection to a second electrical apparatus;
- and
- a package enclosure enclosing said semiconductor die and the inner end of said at least one lead, said enclosure having a top surface, a bottom surface, and a plurality of side surfaces, said lower surface of said intermediate portion of said at least one lead of said leadframe being generally coplanar with said bottom surface of said package enclosure and exposed for electrical connection to a lead of the first electrical apparatus, portions of the package enclosure located adjacent the plurality of edge surfaces of said intermediate portion of said at least one lead of said leadframe being excised to form excised portions to expose at least a portion of said plurality of edge surfaces of said at least one lead of said leadframe.
Dependencies are inferred from the claim text.