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US 12,751,305 B2Granted
Submounts with stud protrusions for semiconductor packages
OwnerAfshin Dadvand, Devarajan Balaramaninventors
Life of this patent
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Abstract
Semiconductor packages are provided. In one example, a semiconductor package includes a submount. The semiconductor package further includes a semiconductor die on the submount. The submount defines a base plane, and the submount includes at least one stud protrusion extending from the base plane in a direction toward the semiconductor die.
Claims32
A semiconductor package, comprising:
- a submount;
- and
- a semiconductor die on the submount,
- wherein the submount defines a base plane, wherein the submount comprises at least one stud protrusion extending from the base plane in a direction toward the semiconductor die, and
- wherein the at least one stud protrusion is integral with the submount, and the semiconductor package has a bond line thickness (BLT) that is substantially equal to a height of the at least one stud protrusion.
2 more elements
A submount, comprising:
- a surface defining a base plane;
- and
- at least one stud protrusion comprising a planar surface that is less than about 10% of a surface area of the base plane defined by the submount,
- wherein the at least one stud protrusion extends from a base plane,
- wherein the at least one stud protrusion is integral with the submount.
2 more elements
A semiconductor package, comprising:
- a submount;
- and
- a semiconductor die on the submount,
- wherein the submount defines a base plane, wherein the submount comprises at least one stud protrusion extending from the base plane in a direction toward the semiconductor die, the at least one stud protrusion having a planar surface that is less than about 10% of a surface area of the base plane defined by the submount.
1 more element
Dependencies are inferred from the claim text.