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US 2026/0293703 A1Published application
Method of manufacturing a plurality of semiconductor devices as well as a corresponding semiconductor device
AssigneeNexperia B.V.
InventorsRegnerus Hermannus Poelma, Adam Brown, Mrunal Khaderbad, Jörg Syré
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Abstract
A method of manufacturing semiconductor devices, the method includes the steps of providing a carrier layer including a first surface and a second surface opposite to the first surface, attaching a first metallization layer to the first surface of the carrier layer, transferring a metal paste to the first metallization layer for creating first patterned metal pads and dicing the carrier layer to provide the plurality of semiconductor devices.
Claims17
A method of manufacturing a plurality of semiconductor devices, wherein the method comprises the steps of:
- providing a carrier layer comprising a first surface and a second surface opposite to the first surface;
- attaching a first metallization layer to the first surface of the carrier layer;
- transferring a metal paste to the first metallization layer for creating first patterned metal pads, and
- dicing the carrier layer to provide the plurality of semiconductor devices.
1 more element
Dependencies are inferred from the claim text.