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AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, Ed A. Shrock, Scott Clifford, Jerrold L. King, Walter Moden
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An improved method for attaching a semiconductor die to a leadframe is provided The improved method comprises forming a patterned adhesive layer on a side of a semiconductor wafer prior to singulation of the dies from the wafer. The adhesive layer is patterned such that wire bonding pads on the dies, as well as the streets between the dies, are free of adhesive material The adhesive layer may be deposited and patterned using a hot or cold screen printing process, by depositing and photopatterning a photosensitive adhesive, or using a resist etch back method. During a packaging process for attaching a die to a leadframe, the adhesive layer is heated and the lead fingers of the leadframe are placed in contact with the die under pressure. In an alternate embodiment of the invention, the lead fingers, rather than a side of the dies, are coated with an adhesive layer.
A method of attaching a semiconductor die formed with a plurality of bonding pads to a leadframe having a plurality of continuous metal lead fingers adapted to extend across a surface of the die for attachment to the bonding pads using fine bond wires, comprising:
In semiconductor manufacture a method for attaching a semiconductor die to a leadframe, having a plurality of continuous metal lead fingers, said method comprising:
The method as claimed in claim 19 and wherein the adhesive layer is formulated to function as an insulating/passivating layer for the wafer.
A method for attaching a semiconductor die to a leadframe for a semiconductor package, comprising:
Dependencies are inferred from the claim text.