Semiconductor device
AssigneeRohm Co., Ltd.
InventorsDaichi NIWA, Koshun SAITO
Life of this patent
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Abstract
A semiconductor device includes a substrate, a semiconductor element, a connection pad, a plated layer, a wire, and an encapsulation resin. The substrate includes a main surface. The semiconductor element is mounted on the main surface and includes a main surface electrode. The connection pad is formed of Cu, arranged with respect to the substrate, separated from the substrate, and includes a connection surface. The plated layer is formed of Ni and partially covers the connection surface. The wire is formed of Al and bonded to the main surface electrode and the plated layer. The encapsulation resin encapsulates the semiconductor element, the connection pad, the plated layer, and the wire.
Claims13
A semiconductor device, comprising:
- a substrate including a main surface;
- a semiconductor element mounted on the main surface and including a main surface electrode oriented in the same direction as the main surface;
- a connection pad separated from the substrate in a first direction that is parallel to the main surface;
- a wire including a first end bonded to the main surface electrode and a second end bonded to the connection pad;
- and
- an encapsulation resin encapsulating the semiconductor element, the connection pad, and the wire, wherein
- the wire is formed of Al,
- the connection pad includes
- a base material formed of Cu and including an upper surface oriented in the same direction as the main surface, and
- a plated layer formed of Ni and covering the upper surface of the base material, and
- the plated layer is a rough-surface plated layer having a rougher surface than the upper surface of the base material.
Dependencies are inferred from the claim text.