Integrated circuit package having an interposer

An integrated circuit assembly comprising:

• (a) a lead frame including a die attach pad and a plurality of bonding fingers positioned proximate to said die attach pad;
• (b) interposer means including
• (i) a thin, flexible, planar insulator having a first side attached to said die attach pad;
• and
• (ii) a plurality of substantially planar conductive traces provided on a second side of said insulator which extend from a centrally located die attach area of said assembly towards the edges of said insulator, each of said conductive traces having an inner end and an outer end, wherein said inner ends terminate proximate said die attach area and said outer ends terminate proximate to said edges of said insulator, and wherein said inner ends are narrower in width than said outer ends;
• (c) an integrated circuit die attached within said die attach area;
• (d) a first plurality of wires coupling said integrated circuit die to said plurality of traces;
• (e) a second plurality of wires coupling said plurality of traces to said plurality of bonding fingers;
• and
• (f) means for encapsulating said bonding fingers, said interposer means, said integrated circuit die, and said first and second plurality of wires.