Semiconductor device

A semiconductor device comprising:

• a first lead;
• a semiconductor element provided with a first electrode;
• a conductive member electrically connecting the first lead and the first electrode to each other;
• a first conductive joining layer conductively joining the first lead and the conductive member to each other;
• and
• a second conductive joining layer conductively joining the first electrode and the conductive member to each other, wherein
• the conductive member includes a first surface facing the first lead in a thickness direction of the semiconductor element, and a second surface facing the first lead in a first direction orthogonal to the thickness direction,
• the first lead includes a third surface facing the first surface, and a fourth surface facing the second surface,
• the first conductive joining layer is in contact with the first surface and the third surface,
• the first lead includes a first obverse surface facing toward the same side as the third surface in the thickness direction, the first obverse surface being located on a side of the fourth surface opposite to the third surface in the thickness direction, and
• the first conductive joining layer is in contact with the first obverse surface.