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US 2026/0305369 A1Published application
Apparatus including an isolation assembly
OwnerSreeram SubramanyamNasum, Vijaylaxmi Khanolkar +1inventors
InventorsSreeram SubramanyamNasum, Vijaylaxmi Khanolkar, Tarunvir Singh
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Abstract
Described examples include an apparatus including a package substrate having a die attach pad and a first semiconductor die on the die attach pad, the first semiconductor die including a transmitter. The apparatus also includes an assembly having a first plate coupled to the transmitter, a second plate separated from the first plate by a dielectric and a second semiconductor die on the die attach pad, the second semiconductor die including a receiver coupled to the second plate.
Claims16
An apparatus, comprising:
- a first semiconductor die on a first die attach pad, the first semiconductor die including a transmitter;
- a metal structure including a first plate coupled to the transmitter, a second plate separated from the first plate by a dielectric material, a third plate conductively coupled to the second plate, and a fourth plate separated from the third plate by the dielectric material;
- and
- a second semiconductor die on a second die attach pad, the second semiconductor die including a receiver coupled to the fourth plate.
1 more element
An apparatus, comprising:
- a first die attach pad and a second die attach pad;
- a first semiconductor die on the first die attach pad, the first semiconductor die including a transmitter;
- a metal structure including a first bond pad coupled to the transmitter, a first metal finger coupled to the first bond pad, a second metal finger proximate to the first metal finger, a third metal finger proximate to the second metal finger, and a second bond pad coupled to the third metal finger;
- and
- a second semiconductor die on the second die attach pad, the second semiconductor die including a receiver coupled to the second bond pad, wherein the metal structure further includes a lower portion and a metal layer on the lower portion and the metal layer includes the first bond pad, the first metal finger, the second metal finger, the third metal finger, and the second bond pad.
2 more elements
Dependencies are inferred from the claim text.