H10W 70/415
Leadframe inner leads serving as die pads
Official title: {Leadframe inner leads serving as die pads}
H10W70/415 (Leadframe inner leads serving as die pads) appears on 1,841 US grants and 1,411 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,841
- Published applications
- 1,411
- Assignees
- 338
- Inventors
- 2,348
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 5 | 0 |
| 1991 | 7 | 0 |
| 1992 | 10 | 0 |
| 1993 | 26 | 0 |
| 1994 | 37 | 0 |
| 1995 | 31 | 0 |
| 1996 | 44 | 0 |
| 1997 | 37 | 0 |
| 1998 | 67 | 0 |
| 1999 | 84 | 0 |
| 2000 | 111 | 0 |
| 2001 | 139 | 65 |
| 2002 | 104 | 121 |
| 2003 | 114 | 88 |
| 2004 | 89 | 70 |
| 2005 | 80 | 79 |
| 2006 | 67 | 75 |
| 2007 | 46 | 71 |
| 2008 | 43 | 65 |
| 2009 | 43 | 54 |
| 2010 | 51 | 56 |
| 2011 | 49 | 34 |
| 2012 | 45 | 32 |
| 2013 | 38 | 37 |
| 2014 | 46 | 33 |
| 2015 | 32 | 31 |
| 2016 | 32 | 31 |
| 2017 | 43 | 61 |
| 2018 | 40 | 45 |
| 2019 | 39 | 52 |
| 2020 | 50 | 55 |
| 2021 | 37 | 46 |
| 2022 | 41 | 50 |
| 2023 | 36 | 28 |
| 2024 | 33 | 53 |
| 2025 | 26 | 59 |
| 2026 | 16 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor module6 Oct 2026US 12,757,769 B2Shindengen Electric Manufacturing Co., Ltd.
- Semiconductor module and power converter22 Sep 2026US 12,745,633 B2Mitsubishi Electric Corporation
- Diode layer stack flip-chip mounted to a leadframe by use of a copper nickel tin metallization stack and diffusion soldering15 Sep 2026US 12,740,438 B2Infineon Technologies Austria AG
- Power semiconductor device and manufacturing method8 Sep 2026US 12,733,493 B2Hitachi Energy Ltd
- Method for manufacturing semiconductor apparatus and semiconductor apparatus8 Sep 2026US 12,733,511 B2Rohm Co., Ltd.
- Semiconductor device24 Sep 2026US 2026/0293272 A1Kabushiki Kaisha Toshiba
- Semiconductor device24 Sep 2026US 2026/0293706 A1Kabushiki Kaisha Toshiba
- Semiconductor device10 Sep 2026US 2026/0271742 A1Rohm Co., Ltd.
- Semiconductor device packages with reduced form factor10 Sep 2026US 2026/0271745 A1Semiconductor Components Industries, LLC
- Electronic device and method of singulating6 Aug 2026US 2026/0231709 A1Texas Instruments Incorporated
Most cited
By later US patents
- Package semiconductor chip567US 4,862,245 AInternational Business Machines Corporation · 1989
- Thin, stackable semiconductor packages437US 6,303,997 B1Amkor Technology, Inc. · 2001
- Encapsulated semiconductor device package having holes for electrically conductive material423US 5,608,265 AHitachi, Ltd. · 1997
- Semiconductor chip package377US 5,677,566 AMicron Technology, Inc. · 1997
- Plastic integrated circuit device package and leadframe having partially undercut leads and die pad364US 6,281,568 B1Amkor Technology, Inc. · 2001