US 2026/0271745 A1 · SEMICONDUCTOR DEVICE PACKAGES WITH REDUCED FORM FACTOR

Abstract

In a general aspect, a semiconductor device assembly includes a substrate having a patterned metal layer, a first semiconductor die coupled with a first portion of the patterned metal layer, and a plurality of conductive terminals. At least one of the plurality of conductive terminals is coupled with a second portion of the patterned metal layer. The assembly also includes a die attach paddle coupled with a third portion of the patterned metal layer, and a second semiconductor die coupled with the die attach paddle. The assembly further includes a plurality of wire bonds respectively electrically coupling the second semiconductor die with a first conductive terminal of the plurality of conductive terminals, the second semiconductor die with the die attach paddle, the second semiconductor die with the first semiconductor die, and the first semiconductor die with a second conductive terminal of the plurality of conductive terminals.

Claims22

Dependent claims

A semiconductor device assembly comprising:

a substrate having a patterned metal layer;
a first semiconductor die coupled with a first portion of the patterned metal layer;
a plurality of conductive terminals, at least one of the plurality of conductive terminals being coupled with a second portion of the patterned metal layer;
a die attach paddle coupled with a third portion of the patterned metal layer;
a second semiconductor die coupled with the die attach paddle;
a first bond wire electrically coupling the second semiconductor die with a first conductive terminal of the plurality of conductive terminals;
a second bond wire electrically coupling the second semiconductor die with the die attach paddle;
a third bond wire electrically coupling the second semiconductor die with the first semiconductor die;
and
a fourth bond wire electrically coupling the first semiconductor die with a second conductive terminal of the plurality of conductive terminals.

7 more elements

Dependencies are inferred from the claim text.

Semiconductor device packages with reduced form factor

Life of this patent

Semiconductor device packages with reduced form factor

Life of this patent

Abstract

Claims22