Semiconductor device

Abstract

According to one embodiment, a semiconductor device includes: a semiconductor chip; a first frame electrically connected to a first electrode arranged in a top surface of the semiconductor chip; a second frame electrically connected to a second electrode arranged in a bottom surface of the semiconductor chip; and a sealing material configured to seal the semiconductor chip. The first frame includes a first electrode portion formed in a planar shape and electrically connected to the first electrode, and a first lead extending from the first electrode portion. The first electrode portion is exposed from the sealing material. The second frame includes a second electrode portion formed in a planar shape and electrically connected to the second electrode, a convex portion extending from the second electrode portion and curving so as to protrude downward, and a second lead extending from the convex portion.

Dependencies are inferred from the claim text.