Semiconductor package assembly with electric field modulation structures

A semiconductor package assembly consisting of a semiconductor package and a molding resin case, the semiconductor package comprising:

• a lead frame having a first lead frame side and a second lead frame side opposite to the first lead frame side;
• a semiconductor die structure having a first die side and a second die side opposite to the first die side, wherein the semiconductor die structure is mounted with its second die side on the first lead frame side of the lead frame, resulting in a first conductive connection;
• at least one bond element being connected to the first die side of the semiconductor die structure, resulting in at least a one further conductive connection;
• wherein the molding resin case encapsulates at least the semiconductor die structure, and wherein the lead frame and a first element part of the at least one bond element connected to the semiconductor die structure, leaves at least the second lead frame side of the lead frame and the other element part of the at least one bond element partly exposed;
• wherein the at least one bond element is provided with electric field modulation structures structured to alter an electric field created between the first conductive connection and the at least further conductive connection during operation of the semiconductor package assembly, wherein the electric field modulation structures are formed as a shielding plate mounted to the first element part of the at least one bond element, and the shielding plate extends from the first element part of the at least one bond element towards the lead frame, and wherein the shielding plate is encapsulated by the molding resin case.