H10W 70/413
Insulating or insulated substrates serving as die pads
Official title: {Insulating or insulated substrates serving as die pads (H10W70/468 takes precedence)}
H10W70/413 (Insulating or insulated substrates serving as die pads) appears on 208 US grants and 223 published applications in this corpus.
Search patents in H10W- Granted patents
- 208
- Published applications
- 223
- Assignees
- 96
- Inventors
- 393
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 6 | 0 |
| 1995 | 7 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 6 | 0 |
| 2001 | 4 | 2 |
| 2002 | 4 | 8 |
| 2003 | 5 | 11 |
| 2004 | 3 | 8 |
| 2005 | 8 | 4 |
| 2006 | 4 | 4 |
| 2007 | 2 | 5 |
| 2008 | 3 | 5 |
| 2009 | 4 | 5 |
| 2010 | 2 | 3 |
| 2011 | 4 | 4 |
| 2012 | 3 | 3 |
| 2013 | 4 | 8 |
| 2014 | 11 | 16 |
| 2015 | 9 | 9 |
| 2016 | 8 | 11 |
| 2017 | 19 | 14 |
| 2018 | 8 | 2 |
| 2019 | 6 | 7 |
| 2020 | 7 | 9 |
| 2021 | 8 | 13 |
| 2022 | 11 | 13 |
| 2023 | 9 | 13 |
| 2024 | 10 | 19 |
| 2025 | 7 | 16 |
| 2026 | 7 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- High voltage integrated circuit packages with diagonalized lead configuration and method of making the same17 Feb 2026US 12,557,668 B2Allegro MicroSystems, LLC
- Packaged device, method for manufacturing, and lead frame27 Aug 2026US 2026/0255985 A1NXP USA, Inc.
- Power Semiconductor Device Package20 Aug 2026US 2026/0247994 A1Wolfspeed, Inc.
- Irregular direct bonded metal (dbm) and connection substrate16 Jul 2026US 2026/0206584 A1Semiconductor Components Industries, LLC
- Semiconductor device16 Jul 2026US 2026/0206636 A1Rohm Co., Ltd.
- Semiconductor device module with stacked interconnections and methods of manufacture11 Jun 2026US 2026/0165118 A1Semiconductor Components Industries, LLC
Most cited
By later US patents
- Dissimilar adhesive die attach for semiconductor devices210US 5,304,842 AMicron Technology, Inc. · 1994
- Lead frame structure for IC devices with strengthened encapsulation adhesion189US 5,633,528 ATexas Instruments Incorporated · 1997
- Multi-part lead frame with dissimilar materials and method of manufacturing173US 6,072,228 AMicron Technology, Inc. · 2000
- Method for fabricating a multichip semiconductor device having two interdigitated leadframes160US 5,147,815 AMotorola, Inc. · 1992
- Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape143US 5,140,404 AMicron Technology, Inc. · 1992