Power electronics module

A power electronics module comprising:

• a printed circuit board comprising power semiconductors arranged on connecting regions of an uppermost layer of said printed circuit board, wherein the printed circuit board has a preset dimension in order to arrange a preset maximum number of power semiconductors thereon;
• and
• a lead frame arranged above the power semiconductors for three-dimensional power and control routing, wherein the lead frame comprises:
• a drain-source connection that is configured to be brought into electrical contact with a drain-source contact of the printed circuit board;
• a load-source connection that is opposite the drain-source connection via the power semiconductors and that is formed from a plurality of subregions, each of which is configured to be brought into electrical contact with one of the power semiconductors;
• and
• in each case, a gate-source terminal and a kelvin-source terminal, which are each arranged above the load-source connection and are in electrical contact with the power semiconductors;
• and
• at least one dummy chip consisting of an electrically nonconductive material arranged on each of the connecting regions of the uppermost layer which are not populated by the power semiconductors.