Back to results
US 6,072,228 AGranted
Multi-part lead frame with dissimilar materials and method of manufacturing
AssigneeMicron Technology, Inc.
InventorsS. Derek Hinkle, Jerry M. Brooks, David J. Corisis
Life of this patent
Estimating the term…
Abstract
A multi-leadframe die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi part lead frame assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi part lead frame may be dissimilar.
Claims73
A lead frame for attaching a semiconductor device thereto, said lead frame comprising:
- a die paddle onto which said semiconductor device is to be attached, said die paddle being of a first material;
- and
- a lead frame including at least two carriers, said lead frame being of a second material different than the first material of said lead frame and having a plurality of leads.
A lead frame for attaching a semiconductor device thereto, said lead frame comprising:
- a separately formed die paddle onto which said semiconductor device is to be attached;
- a separately formed lead frame attached to said separately formed die paddle, said separately formed lead frame including at least two carriers, said lead frame having a plurality of leads, each lead of the plurality of leads having a length terminating adjacent said semiconductor device to be attached to said separately formed die paddle, the electrical conductivity of said lead frame being different than that of said die paddle.
A semiconductor die assembly comprising:
- a semiconductor die including an active surface having at least one bond pad formed thereon;
- a die paddle onto which said semiconductor die is attached, said die paddle being of a first material;
- a lead frame including at least two carriers, each carrier having an attachment tab receiving portion, said lead frame being of a second material different than the first material of said lead frame and having a plurality of leads;
- and
- at least one interconnection between at least one lead of said plurality of leads of said lead frame and said at least one bond pad of said semiconductor die.
2 more elements
A semiconductor die assembly comprising:
- a semiconductor die including an active surface having at least one bond pad formed thereon;
- a separately formed die paddle of a first material onto which said semiconductor die is attached;
- a separately formed lead frame of a second material different than the first material of the separately formed die paddle including at least two carriers, each carrier having an attachment tab receiving portion, said lead frame having a plurality of leads, the plurality of leads each having a length terminating adjacent said semiconductor die;
- and
- at least one interconnection between at least one lead of said plurality of leads of said separately formed lead frame and said at least one bond pad of said semiconductor die attached to said separately formed die paddle.
2 more elements
A semiconductor die assembly comprising:
- a semiconductor die including an active surface having at least one bond pad formed thereon;
- a die paddle of a first material onto which said semiconductor die is attached;
- at least one tie bar connected to said die paddle, the tie bar including an attachment tab thereon;
- a lead frame of a second material different than the first material of the die paddle including carriers, each carrier having an attachment tab receiving portion attached to a portion of said attachment tab of said at least one tie bar, and a plurality of leads, each lead including an inner lead portion and an outer lead portion;
- and
- at least one interconnection between at least one said inner lead portion of said lead frame and said at least one bond pad of said semiconductor die.
3 more elements
A semiconductor die assembly comprising:
- a semiconductor die including an active surface having at least one bond pad formed thereon;
- a die paddle of a first material onto which said semiconductor die is attached;
- at least one tie bar connected to said die paddle, said at least one tie bar including an enlarged attachment tab thereon, said enlarged attachment tab being larger than the at least one tie bar;
- a lead frame of a second material different than the first material of said die paddle including carriers, each carrier having an attachment tab receiving portion having an aperture therein attached to a portion of said enlarged attachment tab of said at least one tie bar, and a plurality of leads, each lead including an inner lead portion and an outer lead portion;
- and
- at least one interconnection between at least one said inner lead portion of said lead frame and said at least one bond pad of said semiconductor die.
3 more elements
A semiconductor die assembly comprising:
- a semiconductor die including an active surface having at least one bond pad formed thereon;
- a die paddle of a first material onto which said semiconductor die is attached;
- at least one tie bar connected to said die paddle, said at least one tie bar including an enlarged attachment tab thereon, said enlarged attachment tab being larger than the at least one tie bar;
- a lead frame of a second material different than the first material of said die paddle including carriers, each carrier having an attachment tab receiving portion attached to a portion of said enlarged attachment tab of said at least one tie bar, and a plurality of leads, each lead including an inner lead portion and an outer lead portion;
- and
- at least one interconnection between at least one said inner lead portion of said lead frame and said at least one bond pad of said semiconductor die.
3 more elements
A semiconductor die assembly comprising:
- a semiconductor die including an active surface having at least one bond pad formed thereon;
- a die paddle of a first material onto which said semiconductor die is attached;
- at least one tie bar connected to said die paddle, said at least one tie bar including an enlarged attachment tab thereon, said enlarged attachment tab being larger than the at least one tie bar;
- a lead frame of a second material different than the first material of said die paddle including carriers, each carrier having an attachment tab receiving portion having an aperture therein and a shape substantially the same as the enlarged attachment tab on said at least one tie bar, said attachment tab receiving portion attached to a portion of said enlarged attachment tab of said at least one tie bar, and a plurality of leads, each lead including an inner lead portion and an outer lead portion;
- and
- at least one interconnection of at least one said inner lead portion of said lead frame and said at least one bond pad of said semiconductor die.
3 more elements
Dependencies are inferred from the claim text.