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US 12,557,668 B2Granted
High voltage integrated circuit packages with diagonalized lead configuration and method of making the same
AssigneeAllegro MicroSystems, LLC
InventorsMaurizio Salato, William P. Taylor
Life of this patent
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Abstract
Aspects of the present disclosure include systems, structures, circuits, and methods providing integrated circuit (IC) packages or modules having diagonalized leads. First and second semiconductor dies are disposed on a substrate. First and second coils are configured on the substrate for a transformer. The transformer may include a core. The leads or pins may be aligned along a diagonal of the package body, providing increased creepage. The IC packages and modules may include various types of circuits; in some examples, IC packages or modules may include a galvanically isolated gate driver or other high voltage circuit.
Claims40
A voltage isolated integrated circuit (IC) package comprising:
- a substrate configured to receive first and second semiconductor dies and including a plurality of leads, wherein the plurality of leads includes a first lead set and a second lead set for the first and second semiconductor dies, respectively;
- a molding material configured to cover a portion of the substrate and form a rectangular package body having a length (L), a width (W), and a height (H), wherein the rectangular package body has a longitudinal axis dividing the body along the width (W);
- and
- first and second coils configured as a transformer and disposed in the rectangular package body, each coil including a plurality of windings connected to the first and second semiconductor dies, respectively;
- wherein the first and second lead sets protrude from the package body;
- wherein the first and second lead sets are disposed on opposing sides of the longitudinal axis and at opposing ends of the rectangular package body, and
- wherein a diagonal line of minimal distance extending from any point on the first lead set to any point on the second lead set is greater than the length L for maximizing the creepage distance of the IC package.
4 more elements
A voltage isolated integrated circuit (IC) package comprising:
- a substrate configured to receive first and second semiconductor dies and including a plurality of leads, wherein the plurality of leads includes a first lead set and a second lead set for the first and second semiconductor dies, respectively;
- a molding material configured to cover a portion of the substrate and form a rectangular package body having a length (L), a width (W), and a height (H), wherein the body has a longitudinal axis dividing the body along the width (W);
- and
- first and second coils configured as a transformer and disposed in the rectangular package body, each coil including a plurality of windings connected to the first and second semiconductor dies, respectively;
- wherein the first and second lead sets protrude from the rectangular package body;
- wherein the first and second lead sets are disposed at on opposing sides of the longitudinal axis and at opposing ends of the rectangular package body;
- and
- wherein the width (W) comprises three equal-width thirds including a middle third and two outer thirds on either side of the middle third, wherein the first and second lead sets are disposed in one of the outer thirds, respectively.
5 more elements
An integrated circuit (IC) chip package comprising:
- a lead frame configured to receive at least one semiconductor die and including a plurality of leads, wherein the plurality of leads includes a first lead set and a second lead set for the first and second semiconductor dies, respectively;
- and
- a molding material configured to cover a portion of the lead frame and form a rectangular package body having a length (L), a width (W), and a height (H), wherein the rectangular package body has a longitudinal axis dividing the body along the width (W);
- wherein the first and second lead sets include exposed portions on the rectangular package body;
- and
- wherein the first lead set and the second lead set are disposed at on opposing sides of the longitudinal axis and at opposing ends of the rectangular package body,
- wherein a diagonal line of minimal distance extending from any point on the first lead set to any point on the second lead set is greater than the length L for maximizing the creepage distance of the IC package.
4 more elements
An integrated circuit (IC) chip package comprising:
- a lead frame configured to receive at least one semiconductor die and including a plurality of leads, wherein the plurality of leads includes a first lead set and a second lead set for the first and second semiconductor dies, respectively;
- and
- a molding material configured to cover a portion of the lead frame and form a rectangular package body having a length (L), a width (W), and a height (H), wherein the rectangular package body has a longitudinal axis dividing the body along the width (W);
- wherein the first and second lead sets include exposed portions on the rectangular package body;
- wherein the first lead set and the second lead set are disposed at on opposing sides of the longitudinal axis and at opposing ends of the rectangular package body, and
- wherein the width (W) comprises three equal-width thirds including a middle third and two outer thirds on either side of the middle third, wherein the first and second lead sets are disposed in one of the outer thirds, respectively.
3 more elements
A method of making a high-voltage integrated circuit (IC) package, the method comprising:
- providing a substrate configured to receive at least one semiconductor die and including a plurality of leads, wherein the plurality of leads includes a first lead set and a second lead set for connection to the at least one semiconductor die;
- molding a molding material to form a package body covering a portion of the substrate, wherein the package body has a length (L), a width (W), and a height (H), and wherein the package body has a longitudinal axis dividing the body along the width (W);
- and
- configuring the first lead set and second lead set on opposing sides of the longitudinal axis and at opposing ends of the package body,
- wherein a diagonal line of minimal distance extending from any point on the first lead set to any point on the second lead set is greater than the length L for maximizing the creepage distance of the IC package.
2 more elements
Dependencies are inferred from the claim text.