Semiconductor device

A semiconductor device, comprising:

• a die pad including:
• a first die pad including a first main surface, and
• a second die pad including a second main surface;
• switching elements including:
• first switching elements connected to the first main surface, and
• second switching elements connected to the second main surface
• each of the switching elements including an element main surface and an element back surface that face in opposite directions and further including a control electrode and a main surface drive electrode that are formed on the element main surface and a back surface drive electrode that is formed on the element back surface, the back surface drive electrode being connected to the main surface of the corresponding die pad;
• a control lead disposed separate from the die pad, the control lead including:
• a first control lead, and
• a second control lead;
• and
• a control connection member including:
• a first control connection member connecting the control electrodes of the first switching elements to the first control lead, and
• a second control connection member connecting the control electrodes of the second switching elements to the second control lead, wherein
• the switching elements are disposed so that the control electrodes align in a first direction that is parallel to the main surface of the corresponding die pad,
• each of the first and second control connection members includes:
• an electrode connector, a lead connector, and
• a joint,
• the electrode connector linearly extends in the first direction and is connected to the control electrodes of the corresponding switching elements,
• the lead connector is disposed parallel to the electrode connector and is connected to the corresponding control lead,
• the joint joins an end of the electrode connector and an end of the lead connector located opposite from the corresponding control lead,
• the first main surface and the second main surface face in the same direction, and
• and the first die pad and the second die pad are disposed in order in a second direction that intersects the first direction.

A semiconductor device, comprising:

• a die pad including:
• a first die pad including a first main surface, and
• a second die pad including a second main surface;
• switching elements including:
• first switching elements connected to the first main surface, and
• second switching elements connected to the second main surface,
• each of the switching elements including an element main surface and an element back surface that face in opposite directions and further including a control electrode and a main surface drive electrode that are formed on the element main surface and a back surface drive electrode that is formed on the element back surface, the back surface drive electrode being connected to the main surface of the corresponding die pad;
• a control lead disposed separate from the die pad, the control lead including:
• a first control lead, and
• a second control lead;
• and
• a control connection member including:
• a first control connection member connecting the control electrodes of the first switching elements to the first control lead, and
• a second control connection member connecting the control electrodes of the second switching elements to the second control lead, wherein
• the switching elements are disposed so that the control electrodes align in a first direction that is parallel to the main surface of the corresponding die pad,
• each of the first and second switching elements includes:
• a first element,
• a second element, and
• a third element,
• the second element and the third element are located at opposite sides of the first element in the first direction, and
• each of the first and second control connection members includes:
• a lead connector including a distal end and a proximal end, the proximal end being connected to the corresponding control lead,
• a first branch part and a second branch part connected to the distal end of the lead connector,
• a first connection part connected between a distal end of the first branch part and the control electrode of the first element of the corresponding switching elements,
• a second connection part connected between a distal end of the second branch part and the control electrode of the first element of the corresponding switching elements,
• a third connection part connected between the distal end of the first branch part and the control electrode of the second element of the corresponding switching elements,
• a fourth connection part connected between the distal end of the second branch part and the control electrode of the third element of the corresponding switching elements,
• the first main surface and the second main surface face in the same direction, and
• the first die pad and the second die pad are disposed in order in a second direction that intersects the first direction.