Semiconductor device and method of manufacturing semiconductor device

A method of manufacturing a semiconductor device using:

• a first heat spreader to which a first semiconductor element is bonded;
• a first frame including a first electrode plate connected to the first heat spreader at a bent portion having an inclination;
• and
• a second frame including a second heat spreader to which a second semiconductor element is bonded and a second electrode plate provided to have a level difference with respect to the second heat spreader,
• wherein the first electrode plate is positioned at a position higher than the first heat spreader,
• the second electrode plate is positioned at a position higher than the second heat spreader, and
• the first electrode plate and the second electrode plate are positioned at a same height,
• the first heat spreader and the second heat spreader are positioned at a same height,
• the second electrode plate is positioned above the first heat spreader,
• the first electrode plate is positioned above the second heat spreader,
• the method comprising:
• a step (a) of superimposing the first frame and the second frame so that the first semiconductor element is sandwiched between the first heat spreader and the second electrode plate, and the second semiconductor element is sandwiched between the second heat spreader and the first electrode plate;
• and
• a step (b) of melting a first brazing material positioned between the first semiconductor element and the second electrode plate and a second brazing material positioned between the second semiconductor element and the first electrode plate to bond the first semiconductor element to the second electrode plate and bond the second semiconductor element to the first electrode plate.