H10W 70/461
Specially adapted for cooling
Official title: {specially adapted for cooling}
H10W70/461 (Specially adapted for cooling) appears on 1,167 US grants and 1,414 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,167
- Published applications
- 1,414
- Assignees
- 342
- Inventors
- 2,384
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 9 | 0 |
| 1991 | 6 | 0 |
| 1992 | 6 | 0 |
| 1993 | 5 | 0 |
| 1994 | 11 | 0 |
| 1995 | 6 | 0 |
| 1996 | 6 | 0 |
| 1997 | 7 | 0 |
| 1998 | 9 | 0 |
| 1999 | 16 | 0 |
| 2000 | 18 | 0 |
| 2001 | 17 | 4 |
| 2002 | 7 | 6 |
| 2003 | 7 | 16 |
| 2004 | 11 | 8 |
| 2005 | 10 | 17 |
| 2006 | 8 | 9 |
| 2007 | 10 | 20 |
| 2008 | 6 | 16 |
| 2009 | 11 | 9 |
| 2010 | 13 | 18 |
| 2011 | 11 | 21 |
| 2012 | 10 | 22 |
| 2013 | 21 | 46 |
| 2014 | 40 | 66 |
| 2015 | 67 | 103 |
| 2016 | 88 | 100 |
| 2017 | 85 | 102 |
| 2018 | 78 | 94 |
| 2019 | 95 | 114 |
| 2020 | 84 | 83 |
| 2021 | 73 | 92 |
| 2022 | 68 | 99 |
| 2023 | 59 | 100 |
| 2024 | 66 | 85 |
| 2025 | 58 | 106 |
| 2026 | 46 | 58 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor package15 Sep 2026US 12,740,441 B2inergy Technology Inc.
- Method of manufacturing semiconductor devices and corresponding semiconductor device8 Sep 2026US 12,733,515 B2STMicroelectronics S,r.l.
- Semiconductor device and method of manufacturing semiconductor device8 Oct 2026US 2026/0314437 A1Mitsubishi Electric Corporation
- Semiconductor device and method of manufacturing semiconductor device1 Oct 2026US 2026/0305383 A1Mitsubishi Electric Corporation
- Package with t-shaped source electrode1 Oct 2026US 2026/0305387 A1GaNrich Semiconductor Corporation
- Semiconductor device24 Sep 2026US 2026/0293706 A1Kabushiki Kaisha Toshiba
- Small outline transistor with thermal flat lead24 Sep 2026US 2026/0293707 A1
Most cited
By later US patents
- Molded circuit package having heat dissipating post312US 5,172,213 AAT&T Bell Laboratories · 1992
- Semiconductor device and module289US 5,592,019 AMitsubishi Denki Kabushiki Kaisha · 1997
- Semiconductor device and an electronic device with the semiconductor devices mounted thereon226US 5,266,834 AHitachi, Ltd. · 1993
- Resin mold semiconductor device218US 5,365,106 AKabushiki Kaisha Toshiba · 1994
- Interdigitated leads-over-chip lead frame for supporting an integrated circuit die191US 5,973,935 AMicron Technology, Inc. · 1999