Package with t-shaped source electrode
AssigneeGaNrich Semiconductor Corporation
InventorsSheng-Po Wang, Chiao Fu, Chen-Yu Wang, Jia-Tay Kuo
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Abstract
A package includes a package bottom. The package bottom includes a lead frame and a molding compound. The lead frame includes a source electrode, a drain electrode, and a first gate electrode. The molding compound covers the lead frame and exposes the back side of the source electrode, the back side of the drain electrode, and the back side of the first gate electrode. The source electrode forms a first T-shape. The first T-shape includes a first beam and a first column. The first gate electrode is disposed at a first corner defined by the first beam and the first column, while the drain electrode is disposed at one side of the first beam.
Claims20
A package, comprising:
- a package bottom, wherein the package bottom comprises:
- a lead frame comprising a source electrode, a drain electrode, and a first gate electrode;
- a molding compound covering the lead frame and exposing a back side of the source electrode, a back side of the drain electrode, and a back side of the first gate electrode;
- wherein the source electrode forms a first T-shape, the first T-shape comprises a first beam and a first column, the first gate electrode is disposed at a first corner defined by the first beam and the first column, and the drain electrode is disposed at one side of the first beam.
Dependencies are inferred from the claim text.