Resin mold semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorToshiya Watanabe
Life of this patent
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Abstract
A first lead frame A has an island 21 on which a semiconductor chip 24 is mounted. The major surface of the island that is opposite to the major surface on which the semiconductor chip 24 is mounted is exposed to the outside of a resin member. A second lead frame B includes a distortion preventing member 26 having substantially the same shape as the island 21 of the first lead frame A. The major surface of the distortion preventing member 26 that is opposite to the major surface facing the island 21 is exposed to the outside of the resin member. The semiconductor chip 24 is located between the island 21 and the distortion preventing member 26. Thus, the semiconductor device has low thermal resistance, and its final shape has no distortion.
Claims4
A resin mold semiconductor device comprising:
- a first lead frame including an island and at least one lead, said island having a first major surface on which a semiconductor chip is mounted, and a second major surface opposite to the first major surface and exposed at an outside surface of a resin member, each lead being located in an area adjacent to the island;
- and
- a second lead frame including a distortion preventing member having a substantially similar shape to that of the island of the first lead frame, said distortion preventing member having a first major surface facing the first major surface of the island of the first lead frame and a second major surface exposed at an opposite outside surface of the resin member, the second lead frame further including a gap along an edge of the distortion preventing member that corresponds to the area in which each lead is located when the second lead frame is positioned proximate to the first lead frame.
Dependencies are inferred from the claim text.