Semiconductor package

A semiconductor package, comprising:

• a semiconductor chip comprising a drain surface and a source surface opposite to each other;
• a drain lead frame assembly comprising a drain contact plate, a drain connecting section, and a plurality of drain leads, wherein the drain contact plate, the drain connecting section, and the drain leads are integrally formed into one piece, the drain connecting section connects the drain contact plate to the drain leads, the drain contact plate is physically connected to the drain surface, an area of the drain contact plate is larger than an area of the drain surface;
• a source lead frame assembly comprising a source contact plate, a source connecting section, and a plurality of source leads, wherein the source contact plate, the source connecting section, and the source leads are integrally formed into one piece, the source connecting section connects the source contact plate to the source leads, the source contact plate is physically connected to the source surface, an area of the source contact plate is smaller than an area of the source surface, wherein the source contact plate further comprises at least one opening exposing the source surface;
• and
• an insulating layer encapsulating the semiconductor chip and surrounding the drain contact plate and the source contact plate.