Semiconductor device

A semiconductor device, comprising:

• a substrate formed to extend along a first direction;
• a first semiconductor chip formed on the substrate;
• a second semiconductor chip formed on the substrate at a predetermined distance from the first semiconductor chip along the first direction;
• a first lead frame extending outwardly beyond the substrate along the first direction, the first lead frame having a lower surface connected to upper surfaces of each of the first semiconductor chip and the second semiconductor chip;
• and
• a heat sink formed on an upper surface of the first lead frame at a position corresponding to the first semiconductor chip and the second semiconductor chip, the heat sink comprises a first heat sink corresponding to the first semiconductor chip and a second heat sink corresponding to the second semiconductor chip, the first heat sink and the second heat sink being spaced apart from each other,
• wherein the first lead frame includes a first groove region formed between a region on the lower surface connected to the upper surface of the first semiconductor chip and a region on the lower surface connected to the upper surface of the second semiconductor chip,
• wherein the heat sink is in contact with a first side of the semiconductor device and the substrate is in contact with a second side of the semiconductor device opposite to the first side, to form a double-sided cooling structure,
• wherein a contact length between the first lead frame and the first semiconductor chip in the first direction is less than a length of the first semiconductor chip in the first direction, and a contact length between the first lead frame and the second semiconductor chip in the first direction is less than a length of the second semiconductor chip in the first direction, and,
• wherein the predetermined distance is formed shorter than a distance between a point where contact between the first lead frame and the first semiconductor chip begins and a point where contact between the first lead frame and the second semiconductor chip begins.