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AssigneesHitachi, Ltd., Hitachi VSLI Engineering Corp.
InventorsKunihiko Nishi, Michio Tanimoto, Toshihiro Yasuhara, Katsuhiro Tabata, Yasuhiro Yoshikawa, Isao Akima, Souichi Kunito, Toshio Nosaka, Hideaki Nakamura
Estimating the term…
A package is provided for achieving higher packing density and higher circuit integration of memories, in particular, a structure is provided having a plurality of thin, surface mount packages which are stacked up. Each of the laminated packages includes a semiconductor pellet, leads fixed to the front surface of the pellet, a radiating plate fixed to the rear surface of the same, and a resin mold member. To achieve a stabilized laminated structure, the mold member is shaped into a convex form on the front side of the pellet and into a concave form on the rear side of the same, so that the concave portion of one package can engage with the convex portion of another package.
A semiconductor module with stacked semiconductor devices comprising:
A semiconductor module with stacked semiconductor devices comprising:
A semiconductor module with stacked semiconductor devices according to claim 24, wherein said plurality of outer leads protrude outwardly from one side of said resin mold member, and wherein an end portion of said radiating plate, including an extension of said first surface portion, an extension of said second surface portion and said end surface portion, is arranged to project from said resin mold member in an opposite direction to a direction in which said outer leads protrude.
Dependencies are inferred from the claim text.