H10W 70/421
Shapes or dispositions
Official title: {Shapes or dispositions}
H10W70/421 (Shapes or dispositions) appears on 6,563 US grants and 7,118 published applications in this corpus.
Search patents in H10W- Granted patents
- 6,563
- Published applications
- 7,118
- Assignees
- 1,020
- Inventors
- 8,692
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 15 | 0 |
| 1978 | 6 | 0 |
| 1979 | 8 | 0 |
| 1980 | 8 | 0 |
| 1981 | 7 | 0 |
| 1982 | 9 | 0 |
| 1983 | 10 | 0 |
| 1984 | 10 | 0 |
| 1985 | 8 | 0 |
| 1986 | 10 | 0 |
| 1987 | 14 | 0 |
| 1988 | 24 | 0 |
| 1989 | 28 | 0 |
| 1990 | 32 | 0 |
| 1991 | 42 | 0 |
| 1992 | 44 | 0 |
| 1993 | 53 | 0 |
| 1994 | 80 | 0 |
| 1995 | 83 | 0 |
| 1996 | 73 | 0 |
| 1997 | 71 | 0 |
| 1998 | 81 | 0 |
| 1999 | 85 | 0 |
| 2000 | 85 | 0 |
| 2001 | 86 | 39 |
| 2002 | 88 | 118 |
| 2003 | 98 | 122 |
| 2004 | 111 | 129 |
| 2005 | 117 | 166 |
| 2006 | 130 | 131 |
| 2007 | 109 | 206 |
| 2008 | 102 | 248 |
| 2009 | 132 | 322 |
| 2010 | 179 | 254 |
| 2011 | 213 | 264 |
| 2012 | 231 | 224 |
| 2013 | 264 | 244 |
| 2014 | 270 | 299 |
| 2015 | 335 | 382 |
| 2016 | 348 | 396 |
| 2017 | 381 | 395 |
| 2018 | 333 | 366 |
| 2019 | 340 | 379 |
| 2020 | 340 | 397 |
| 2021 | 283 | 336 |
| 2022 | 274 | 346 |
| 2023 | 247 | 355 |
| 2024 | 244 | 392 |
| 2025 | 222 | 371 |
| 2026 | 192 | 237 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor packages with wettable flanks and related methods6 Oct 2026US 12,757,696 B2Semiconductor Components Industries, LLC
- Semiconductor package assembly with electric field modulation structures6 Oct 2026US 12,757,751 B2Nexperia B. V.
- Semiconductor device with reverse and observe surfaces6 Oct 2026US 12,757,752 B2Rohm Co., Ltd.
- Electronic device with high draft angle package structure6 Oct 2026US 12,757,753 B2Texas Instruments Incorporated
- Lead frame with a tie bar having branch part29 Sep 2026US 12,751,294 B2Diodes Incorporated
- Semiconductor package with an embedded interconnect and a method of making the same8 Oct 2026US 2026/0314436 A1Texas Instruments Incorporated
- Semiconductor device and method of manufacturing semiconductor device8 Oct 2026US 2026/0314437 A1Mitsubishi Electric Corporation
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
- Semiconductor device8 Oct 2026US 2026/0314463 A1Kabushiki Kaisha Toshiba
- Semiconductor device with an embedded passive component and method of making the same8 Oct 2026US 2026/0314485 A1Texas Instruments Incorporated
Most cited
By later US patents
- Analyte monitoring device and methods of use2,634US 6,175,752 B1TheraSense, Inc. · 2001
- Analyte monitoring device and methods of use2,053US 6,565,509 B1TheraSense, Inc. · 2003
- Analyte monitoring device and methods of use1,062US 7,190,988 B2Abbott Diabetes Care Inc. · 2007
- Analyte monitoring devices and methods of use1,055US 7,003,341 B2Abbott Diabetes Care Inc. · 2006
- Analyte monitoring device and methods of use1,007US 6,990,366 B2TheraSense, Inc. · 2006