H10W 70/433
Of deformation-absorbing parts
Official title: {of deformation-absorbing parts, e.g. leads having meandering shapes (H10W70/481 takes precedence)}
H10W70/433 (Of deformation-absorbing parts) appears on 129 US grants and 121 published applications in this corpus.
Search patents in H10W- Granted patents
- 129
- Published applications
- 121
- Assignees
- 75
- Inventors
- 280
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 5 | 0 |
| 2001 | 5 | 2 |
| 2002 | 2 | 6 |
| 2003 | 3 | 4 |
| 2004 | 1 | 4 |
| 2005 | 5 | 1 |
| 2006 | 1 | 0 |
| 2007 | 3 | 1 |
| 2008 | 0 | 2 |
| 2009 | 1 | 3 |
| 2010 | 2 | 2 |
| 2011 | 3 | 3 |
| 2012 | 3 | 3 |
| 2013 | 2 | 3 |
| 2014 | 7 | 10 |
| 2015 | 7 | 6 |
| 2016 | 8 | 8 |
| 2017 | 11 | 9 |
| 2018 | 7 | 10 |
| 2019 | 9 | 7 |
| 2020 | 6 | 8 |
| 2021 | 3 | 3 |
| 2022 | 3 | 6 |
| 2023 | 3 | 3 |
| 2024 | 3 | 8 |
| 2025 | 2 | 7 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate-on-die package architecture4 Aug 2026US 12,702,021 B2Texas Instruments Incorporated
- Semiconductor device17 Mar 2026US 12,581,962 B2Shinko Electric Industries Co., Ltd.
- Semiconductor device and assortment of semiconductor devices with electrically conductive ribbon configurations4 Nov 2025US 12,463,170 B2STMicroelectronics S,r.l.
- Loading frame for high I/O count packaged semiconductor chip14 Oct 2025US 12,444,664 B2SK Hynix NAND Product Solutions Corp.
- Electronic device with die pads and leads25 Jun 2024US 12,021,010 B2Rohm Co., Ltd.
- Lead-wire frame structure for packaging and sensor package structure29 Jan 2026US 2026/0033346 A1Ningbo Crrc Times Transducer Technology Co., Ltd.
- Loading frame for high i/o count packaged semiconductor chip22 Jan 2026US 2026/0026349 A1SK Hynix NAND Product Solutions Corp. (dba Solidigm)
- Semiconductor device and power conversion device18 Dec 2025US 2025/0385163 A1Mitsubishi Electric Corporation
- Semiconductor device2 Oct 2025US 2025/0309068 A1Rohm Co., Ltd.
- Electronic device18 Sep 2025US 2025/0293126 A1Rohm Co., Ltd.
Most cited
By later US patents
- Resin encapsulated semiconductor device having a reduced thickness and improved reliability201US 6,081,029 AMatsushita Electronics Corporation · 2000
- Lead frame including angle iron tie bar177US 6,303,984 B1Micron Technology, Inc. · 2001
- Lead frame, resin-molded semiconductor device, and method for manufacturing the same151US 6,455,348 B1Matsushita Electric Industrial Co., Ltd. · 2002
- Semiconductor device affixed to an upper and a lower leadframe47US 5,637,915 AFujitsu Limited · 1997
- Tape under frame for conventional-type IC package assembly45US 5,729,049 AMicron Technology, Inc. · 1998