Semiconductor device affixed to an upper and a lower leadframe
AssigneesFujitsu Limited, Kyushu Fujitsu Electronics Limited
InventorsMitsutaka Sato, Junichi Kasai, Masanori Yoshimoto, Kouichi Takeshita
Life of this patent
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Abstract
A semiconductor device includes a semiconductor chip having top and bottom surfaces, upper leads electrically coupled to the semiconductor chip, where a first gap is formed between the upper leads and the top surface of the semiconductor chip, lower leads electrically coupled to the semiconductor chip, where a second gap is formed between the lower leads and the bottom surface of the semiconductor chip, and an encapsulating resin which encapsulates the semiconductor chip so as to maintain the first and second gaps.
Claims14
A semiconductor device comprising:
- a stage having top and bottom surfaces;
- stage support parts which extend outwardly from said stage in the same plane as said stage for supporting said stage;
- wherein said stage support parts have a common height position different from that of the outer leads and each thereof has a corresponding exposed end portion which extends from the encapsulating resin;
- a semiconductor chip which is mounted on the top surface of said stage, said semiconductor chip having a circuit forming surface;
- a plurality of leads respectively having inner leads and outer leads, each of said inner leads having tip ends which are located above the circuit forming surface of the semiconductor chip and are electrically coupled to the semiconductor chip, a gap being formed between the inner leads and the circuit forming surface of the semiconductor chip;
- and
- an encapsulating resin which encapsulates the semiconductor chip and the inner leads so as to maintain the gap and so that the outer leads extend outwardly of the encapsulating resin.
Dependencies are inferred from the claim text.